公开(公告)号：US20240112976A1

公开(公告)日：2024-04-04

申请号：US17957333

申请日：2022-09-30

Applicant: GE Aviation Systems LLC

Inventor： Shung Ik Lee ,  Liqiang Yang ,  Darrell L. Grimes ,  Hyunmin Cho

IPC: H01L23/34 ,  G01K1/143 ,  G01K7/02 ,  G01K7/16 ,  G01R19/165 ,  H01L23/00 ,  H01L23/538 ,  H01L25/07 ,  H02H1/00 ,  H02H7/12

CPC classification number: H01L23/34 ,  G01K1/143 ,  G01K7/02 ,  G01K7/16 ,  G01R19/1659 ,  H01L23/5384 ,  H01L24/32 ,  H01L25/072 ,  H02H1/0007 ,  H02H1/0038 ,  H02H7/1203 ,  H01L2224/32225 ,  H01L2924/10272 ,  H01L2924/13091

Abstract: Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay. A temperature sensor is physically bonded to a top surface of the conductive overlay to provide a direct temperature measurement for the one or more power transistors.

公开(公告)号：US20230361049A1

公开(公告)日：2023-11-09

申请号：US17738498

申请日：2022-05-06

Applicant: GE AVIATION SYSTEMS LLC

Inventor： Liqiang Yang ,  Darrell Lee Grimes ,  Richard Anthony Eddins ,  Shung Ik Lee ,  Judd Everett Swanson

IPC: H01L23/538 ,  H01L25/18 ,  H05K1/18 ,  H01L23/485 ,  H01L23/14 ,  H02M7/5387

CPC classification number: H01L23/5386 ,  H01L25/18 ,  H05K1/181 ,  H01L23/485 ,  H01L23/147 ,  H02M7/5387 ,  H05K2201/10053 ,  H05K2201/10166

Abstract: A modular POL component can be arranged to define a half-bridge converter topology, and can be coupled with other modular POL power components to define a full-bridge or 3-phase AC converter topology based on a desired power output. The assembled POL components can be mounted on a common electrically insulative substrate to define a POL power conversion device to provide the desired power output.