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公开(公告)号：US20230114057A1
公开(公告)日：2023-04-13
申请号：US17499324
申请日：2021-10-12
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Brian Magann Rush , Christopher James Kapusta , David Richard Esler , Liang Yin , Richard Anthony Eddins , Judd Everett Swanson , Liqiang Yang
IPC: H05K7/20
Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.
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公开(公告)号：US11757264B2
公开(公告)日：2023-09-12
申请号：US17232877
申请日：2021-04-16
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Liqiang Yang , Richard Anthony Eddins , Robert Lloyd George , Darrell Lee Grimes
CPC classification number: H02B1/04 , B64D33/00 , H02B1/24 , H02M7/003 , H05K1/181 , H05K2201/10053 , H05K2201/10166
Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.
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公开(公告)号：US20210234343A1
公开(公告)日：2021-07-29
申请号：US17232877
申请日：2021-04-16
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Liqiang Yang , Richard Anthony Eddins , Robert Lloyd George , Darrell Lee Grimes
Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.
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公开(公告)号：US20200091686A1
公开(公告)日：2020-03-19
申请号：US16402914
申请日：2019-05-03
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Liqiang Yang , Richard Anthony Eddins , Robert Lloyd George , Darrell Lee Grimes
Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.
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公开(公告)号：US20190320556A1
公开(公告)日：2019-10-17
申请号：US15955299
申请日：2018-04-17
Applicant: GE AVIATION SYSTEMS, LLC
Inventor： Nader Dariavach , Michel Engelhardt , Liqiang Yang
IPC: H05K7/20
Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.
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Patent Agency Ranking
公开(公告)号：US11950394B2
公开(公告)日：2024-04-02
申请号：US17499324
申请日：2021-10-12
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Brian Magann Rush , Christopher James Kapusta , David Richard Esler , Liang Yin , Richard Anthony Eddins , Judd Everett Swanson , Liqiang Yang
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20345 , H01L23/4735 , H05K7/20272 , H05K7/20936
Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.
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公开(公告)号：US20210176896A1
公开(公告)日：2021-06-10
申请号：US16704522
申请日：2019-12-05
Applicant: GE AVIATION SYSTEMS LLC
Inventor： Liqiang Yang , Richard Anthony Eddins , Darrell Lee Grimes , Michel Engelhardt
IPC: H05K7/20
Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.
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公开(公告)号：US20190300180A1
公开(公告)日：2019-10-03
申请号：US15941932
申请日：2018-03-30
Applicant: GE AVIATION SYSTEMS, LLC
Inventor： Liqiang Yang , Richard Anthony Eddins , Darrell Lee Grimes
IPC: B64D13/08
Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.
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公开(公告)号：US20240112976A1
公开(公告)日：2024-04-04
申请号：US17957333
申请日：2022-09-30
Applicant: GE Aviation Systems LLC
Inventor： Shung Ik Lee , Liqiang Yang , Darrell L. Grimes , Hyunmin Cho
IPC: H01L23/34 , G01K1/143 , G01K7/02 , G01K7/16 , G01R19/165 , H01L23/00 , H01L23/538 , H01L25/07 , H02H1/00 , H02H7/12
CPC classification number: H01L23/34 , G01K1/143 , G01K7/02 , G01K7/16 , G01R19/1659 , H01L23/5384 , H01L24/32 , H01L25/072 , H02H1/0007 , H02H1/0038 , H02H7/1203 , H01L2224/32225 , H01L2924/10272 , H01L2924/13091
Abstract: Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay. A temperature sensor is physically bonded to a top surface of the conductive overlay to provide a direct temperature measurement for the one or more power transistors.
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公开(公告)号：US11551993B2
公开(公告)日：2023-01-10
申请号：US17005536
申请日：2020-08-28
Applicant: GE AVIATION SYSTEMS LLC
Inventor： David Richard Esler , Christopher James Kapusta , Arun V. Gowda , Weijun Yin , Liqiang Yang , Richard Anthony Eddins
IPC: H05K1/02 , F28F13/18 , H01L23/373 , H05K7/20 , F28F13/00 , H01L23/367
Abstract: A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.
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