Abstract:
Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.
Abstract:
A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
Abstract:
A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
Abstract:
Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.
Abstract:
Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.
Abstract:
An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.
Abstract:
A motor overcurrent protection device connectable to a motor. The motor has a rotary shaft and a controlling port. The motor overcurrent protection device includes a sensing unit, a driving unit and a controlling unit. The sensing unit includes a magnetic block arranged on a circumference of the rotary shaft and a Hall device positioned beside the rotary shaft. The magnetic block is rotatable along with the rotary shaft to be instantaneously aligned with the Hall device. The driving unit is electrically connected with the controlling port of the motor. The controlling unit is electrically connected with the sensing unit and the driving unit. When the motor operates, each time the magnetic block is aligned with the Hall device, the Hall device outputs a pulse signal which is stored in the controller of the controlling unit. All the pulse signals are summed up in a preset sensing time of the controller. In the case that the sum does not exceed a standard rotational speed value, the controlling unit via the driving unit will stop the motor from operating so as to protect the motor from malfunctioning due to rising of current.
Abstract:
A heat sink module used in a notebook computer is provided, in which a heat sink fin set is fixed in a fan case and an upper case is disposed on fan leaves within the fan case, the upper cover has a hole disposed at a region over the fan leaves. A heat conducting tube has two ends, with one disposed on the heat sink fin set and the other fixed with a side plate. Then, the thermally conducting piece is fixed on the upper case. Finally, a press and fixation member is disposed on the side plate and assembly of the heat sink module is completed. In case of being used, the thermally conducting piece is bonded on the heat source. As such, not only heat may be moved from the heat source but also the heat sink module has increased strength and reduced weight.
Abstract:
A fan-driven heat dissipating device with enhanced air blowing efficiency is proposed, which is designed for use in conjunction with an integrated circuit device for dissipating the heat produced by the integrated circuit device during operation, and which is characterized by the provision of a secondary air outlet on the lateral side of the casing beside a primary air outlet, which allows part of the radially-flowing air stream to exit the casing laterally from the secondary air outlet, so that frictional loss due to the air flow striking against the inner wall of the casing can be reduced, allowing the fan module to provide a more enhanced air blowing efficiency than the prior art. This feature allows the fan-driven heat dissipating device of the invention to provide a more enhanced heat-dissipating efficiency than the prior art.
Abstract:
A method and system for updating or recovering a computer device's software image using a single portable operating system image stored on a bootable, secure partition on local storage (hard drive); a method and system utilizing delta image patching technology to allow the single image to work on a large number of diverse computer device platforms; and a method for distributing software patches and updates via a, secure local partition to ensure patches and updates are applied to well known software images that have not been modified to include malicious software and do not include any other undesirable changes that have been made to the primary, running operating system image.