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公开(公告)号：US07321492B2
公开(公告)日：2008-01-22
申请号：US11058702
申请日：2005-02-15
Applicant: Frank Wang , Jui-Chan Fan , Chun-Yi Chang
Inventor： Frank Wang , Jui-Chan Fan , Chun-Yi Chang
CPC classification number: H01L23/4006 , H01L23/3672 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.
Abstract translation: 公开了一种用于电子设备的散热器模块，包括至少具有固定孔的基板，至少设置在基板上的散热片，并具有多个散热鳍片和至少设置在基板上的弹性板 并且具有至少一个安装孔，该安装孔将该基板安装在电子设备中与固定孔协调的电子设备部件上，使得该基板可以紧密地结合到电子部件的表面。 此外，由于通过冲压方法在基板上形成散热片组，所以提供散热模块成本低的优点。
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公开(公告)号：US20070240639A1
公开(公告)日：2007-10-18
申请号：US11405640
申请日：2006-04-18
Applicant: Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
CPC classification number: B05C17/00516 , B05C5/02 , H01L21/4882
Abstract: An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.
Abstract translation: 提供一种具有涂覆头的注射器，用于将散热膏均匀地涂覆在待涂覆的表面上，其包括主体，活塞和涂覆头，其中活塞被压制以迫使散热器膏从 通过涂布头将散热膏模制成适于均匀涂布被覆表面的形状，并且也被定量。 此外，在涂层头部的开口部设置有刮削面，从钢板上刮掉多余的散热膏，并且在使用钢板来辅助该散热片的情况下使散热膏的表面平滑化 定量散热片的操作。
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公开(公告)号：US20070237896A1
公开(公告)日：2007-10-11
申请号：US11401365
申请日：2006-04-11
Applicant: Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
CPC classification number: H01L23/4093 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
Abstract translation: 提供了具有散热装置的导热介质的保护盖，其用于覆盖和保护放置在散热装置的底部的底表面处的导热介质。 它包括片状板，弹性壁和容纳室，其中片状板是凹形的并且位于保护罩的一侧，并具有导热介质; 弹性壁沿片状板的边缘延伸，以便提供用于与散热装置夹紧的夹持力; 并且容纳室由片状基板的凹部形成以遮盖和覆盖导热介质; 而板状板通过弹性壁被夹紧到散热装置，使得容纳室用于掩蔽和覆盖导热介质。
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公开(公告)号：US07319592B2
公开(公告)日：2008-01-15
申请号：US11401365
申请日：2006-04-11
Applicant: Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC: H05K7/20
CPC classification number: H01L23/4093 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
Abstract translation: 提供了具有散热装置的导热介质的保护盖，其用于覆盖和保护放置在散热装置的底部的底表面处的导热介质。 它包括片状板，弹性壁和容纳室，其中片状板是凹形的并且位于保护罩的一侧，并具有导热介质; 弹性壁沿片状板的边缘延伸，以便提供用于与散热装置夹紧的夹持力; 并且容纳室由片状基板的凹部形成以遮盖和覆盖导热介质; 而板状板通过弹性壁被夹紧到散热装置，使得容纳室用于掩蔽和覆盖导热介质。
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公开(公告)号：US07589969B2
公开(公告)日：2009-09-15
申请号：US11401875
申请日：2006-04-12
Applicant: Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
Inventor： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
IPC: H05K7/20
CPC classification number: H01L23/34 , H01L2924/0002 , Y10T428/13 , Y10T428/24215 , Y10T428/24273 , Y10T428/28 , H01L2924/00
Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
Abstract translation: 折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。 使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。
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Patent Agency Ranking
公开(公告)号：US20070235177A1
公开(公告)日：2007-10-11
申请号：US11399454
申请日：2006-04-07
Applicant: Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC: H05K7/20
CPC classification number: H01L23/42 , F28F2265/00 , H01L2924/0002 , H01L2924/00
Abstract: A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.
Abstract translation: 提供导热介质保护装置。 至少一个切口形成在片材中，并且片材被弯曲以紧密地接合切口，以便将片材变形为三维形状并形成容纳空间。 当导热介质保护装置覆盖在涂有导热介质的散热片上时，容纳空间容纳用于保持导热介质的导热介质，从而容易地传输涂有导热介质的散热片 。
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公开(公告)号：US20080130240A1
公开(公告)日：2008-06-05
申请号：US11606001
申请日：2006-11-30
Applicant: Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC: H05K7/20
CPC classification number: G06F1/20 , H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
Abstract translation: 热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。 固定结构包括固定构件和弹性构件。 弹性构件的两端分别是紧固部和固定部。 弹性构件的中部是按压部。 此外，悬架臂从固定部分延伸。 当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个， 悬挂臂按压另一个发热电子部件上的另一个导热垫。
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公开(公告)号：US07436673B2
公开(公告)日：2008-10-14
申请号：US11606001
申请日：2006-11-30
Applicant: Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
Inventor： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
CPC classification number: G06F1/20 , H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
Abstract translation: 热传导垫的固定结构分别用于均匀地按压电路板上的两个发热电子元件上的两个导热垫。 固定结构包括固定构件和弹性构件。 弹性构件的两端分别是紧固部和固定部。 弹性构件的中部是按压部。 此外，悬架臂从固定部分延伸。 当紧固部分紧固在电路板上并且固定部分通过固定部件固定在电路板上时，按压部分按压发热电子部件之一的导热焊盘中的一个， 悬挂臂按压另一个发热电子部件上的另一个导热垫。
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公开(公告)号：US20070243345A1
公开(公告)日：2007-10-18
申请号：US11401875
申请日：2006-04-12
Applicant: Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
Inventor： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
CPC classification number: H01L23/34 , H01L2924/0002 , Y10T428/13 , Y10T428/24215 , Y10T428/24273 , Y10T428/28 , H01L2924/00
Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
Abstract translation: 折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。 使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。
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公开(公告)号：US20060181856A1
公开(公告)日：2006-08-17
申请号：US11057335
申请日：2005-02-11
Applicant: Frank Wang , Jui-Chan Fan
Inventor： Frank Wang , Jui-Chan Fan
IPC: H05K7/20
CPC classification number: H05K7/20445
Abstract: Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.
Abstract translation: 公开了一种视频图形阵列（VGA）和芯片组的散热装置。 主要特点是散热装置的集成设计。 使用散热片堆叠在VGA和芯片组上，而不是像以前一样。 散热片散热面积大于常规散热片。 该装置还集成了散热板下面堆叠的其他发热元件，以散热更多，从而增加了散热板的散热效果。 该器件使VGA和芯片组的操作更加有效，延长了其使用寿命。
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