公开(公告)号：US20250029928A1

公开(公告)日：2025-01-23

申请号：US18756425

申请日：2024-06-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Tomohiro ISONO

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/495 ,  H01L25/065

Abstract: A semiconductor device includes a wiring board, a semiconductor element disposed on the wiring board, and a lead having a bonding surface that is bonded to a main electrode of the semiconductor element by a bonding material. The main electrode includes a first pad and a second pad separated by an insulating layer extending in a first direction. The lead has at the bonding surface a recess that faces the main electrode so as to overlap the insulating layer and extends in the first direction. The recess has two outer ends in the first direction, one of which overlaps one end of the lead in plan view. The recess has a bottom surface that faces the main electrode of the semiconductor element, is not in contact with the bonding material and is continuous from the one of the two outer ends thereof to another end thereof in the first direction.

公开(公告)号：US20230143001A1

公开(公告)日：2023-05-11

申请号：US17954696

申请日：2022-09-28

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Tomohiro ISONO

IPC: G01R31/52 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/367

CPC classification number: G01R31/52 ,  H01L24/48 ,  H01L25/0655 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/49844 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48011 ,  H01L2224/48157 ,  H01L2924/13055 ,  H01L2924/1203

Abstract: There is provided a semiconductor module capable of determining a semiconductor chip in which a short-circuit failure has occurred without being disassembled. A semiconductor module includes IGBT provided in each of semiconductor chips connected in parallel, switching of which being controlled by a gate voltage based on a gate signal; two external terminals input with the gate signal; a first connection route group having a first connection route and a third connection route connecting the external terminal and the IGBTs provided in the semiconductor chips respectively; and a second connection route group having a second connection route and a fourth connection route connecting the external terminal and the IGBTs provided in the semiconductor chips respectively.