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公开(公告)号：US20180119928A1
公开(公告)日：2018-05-03
申请号：US15799272
申请日：2017-10-31
发明人： Chuanbiao Liu , Feng Gu , Yuanbin Lin , Xiangling Luo , Xiaofeng Liu , Xi Zheng , Yan Liu
CPC分类号： F21V19/003 , F21K9/20 , F21Y2115/10 , H01L25/167 , H01L33/52 , H01L33/62 , H05K1/0346 , H05K1/036 , H05K1/05 , H05K1/142 , H05K1/181
摘要： An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate.
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公开(公告)号：US10573227B2
公开(公告)日：2020-02-25
申请号：US15995248
申请日：2018-06-01
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Xi Zheng , Yuanbin Lin
摘要： The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.
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公开(公告)号：US10937936B2
公开(公告)日：2021-03-02
申请号：US16502101
申请日：2019-07-03
发明人： Feng Gu , Kuai Qin , Yuanbin Lin , Bin Cai
IPC分类号： H01L33/62 , H01L23/538 , H01L25/075
摘要： Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.
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公开(公告)号：USD864130S1
公开(公告)日：2019-10-22
申请号：US29649732
申请日：2018-06-01
设计人： Feng Gu , Chuanbiao Liu , Kuai Qin , Xi Zheng , Yuanbin Lin
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公开(公告)号：US10378736B2
公开(公告)日：2019-08-13
申请号：US15799272
申请日：2017-10-31
发明人： Chuanbiao Liu , Feng Gu , Yuanbin Lin , Xiangling Luo , Xiaofeng Liu , Xi Zheng , Yan Liu
IPC分类号： H01L23/053 , F21V19/00 , F21K9/20 , H05K1/03 , H05K1/05 , H05K1/14 , H05K1/18 , H01L33/62 , F21Y115/10 , H01L25/16 , H01L33/52
摘要： An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate.
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公开(公告)号：US20180233492A1
公开(公告)日：2018-08-16
申请号：US15729119
申请日：2017-10-10
发明人： Chuanbiao Liu , Xiaofeng Liu , Feng Gu , Kuai Qin , Yuanbin Lin
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , G09F9/33 , H01L33/62 , H01L2224/49113 , H01L2933/0033
摘要： A triangular-combination LED circuit board, comprising a plurality of triangular LED units, wherein vertexes of every six of the LED units are superimposed to jointly form a hexagonal central point such that every six of the LED units form a hexagonal LED array; the LED unit includes a substrate and pads disposed on the substrate; the pads include die bond pads; and three die bond pads are provided, respectively disposed at three vertexes of the triangular LED units. In the present invention, triangular LED units are set to form triangular LED devices which can be more densely arrayed on a PCB, so an LED display with LED devices arrayed at a smaller distance is generated, and pixel definition is strengthened. Meanwhile, in an LED circuit board, the LED units are closely arranged in a hexagonal shape, so the utilization rate of materials can be enhanced; moreover, a plurality of LED units can be bored at one time at the central point of the hexagon, and finally the LED devices can be quickly obtained by simple cutting, thus effectively enhancing the processing efficiency and reducing production cost.
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