Infrared camera system architectures

    公开(公告)号:US09723228B2

    公开(公告)日:2017-08-01

    申请号:US14101258

    申请日:2013-12-09

    Abstract: Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

    Pixel-wise noise reduction in thermal images
    7.
    发明授权
    Pixel-wise noise reduction in thermal images 有权
    热图像中像素降噪

    公开(公告)号:US09208542B2

    公开(公告)日:2015-12-08

    申请号:US14029683

    申请日:2013-09-17

    Abstract: Methods and systems are provided to reduce noise in thermal images. In one example, a method includes receiving an image frame comprising a plurality of pixels arranged in a plurality of rows and columns. The pixels comprise thermal image data associated with a scene and noise introduced by an infrared imaging device. The image frame may be processed to determine a plurality of column correction terms, each associated with a corresponding one of the columns and determined based on relative relationships between the pixels of the corresponding column and the pixels of a neighborhood of columns. In another example, the image frame may be processed to determine a plurality of non-uniformity correction terms, each associated with a corresponding one of the pixels and determined based on relative relationships between the corresponding one of the pixels and associated neighborhood pixels within a selected distance.

    Abstract translation: 提供了方法和系统来减少热图像中的噪音。 在一个示例中,一种方法包括接收包括以多个行和列排列的多个像素的图像帧。 像素包括与场景相关联的热图像数据和由红外成像装置引入的噪声。 可以处理图像帧以确定多个列校正项,每个列修正项与列中的相应列之一相关联,并且基于相应列的像素和列的邻域的像素之间的相对关系来确定。 在另一示例中,图像帧可以被处理以确定多个不均匀性校正项,每一个都与相应的一个像素相关联,并且基于所选择的像素中的相应一个像素和相关邻域像素之间的相对关系确定 距离。

    INFRARED IMAGING DEVICE HAVING A SHUTTER
    8.
    发明申请
    INFRARED IMAGING DEVICE HAVING A SHUTTER 审中-公开
    具有快门的红外成像装置

    公开(公告)号:US20150319378A1

    公开(公告)日:2015-11-05

    申请号:US14747865

    申请日:2015-06-23

    Abstract: A shutter assembly may be provided for an infrared imaging module to selectively block external infrared radiation from reaching infrared sensors of the infrared imaging module. For example, the shutter assembly may comprise a paddle situated external to an optical element (e.g., lens) and adapted to be selectively moved by an actuator to substantially block external infrared radiation from entering the optical element. The shutter assembly may be stacked relative to a housing of the infrared imaging module without excessively increasing the overall profile of the infrared imaging module. A substantially reflective low emissivity interior surface may be provided on the paddle to reflect infrared radiation originating from an infrared sensor assembly of the infrared imaging module back to the infrared sensor assembly.

    Abstract translation: 可以为红外成像模块提供快门组件,以选择性地阻挡外部红外辐射到达红外成像模块的红外传感器。 例如,快门组件可以包括位于光学元件(例如,透镜)外部的桨,并且适于被致动器选择性地移动以基本上阻挡外部红外辐射进入光学元件。 快门组件可以相对于红外成像模块的壳体堆叠,而不会过度增加红外成像模块的整体轮廓。 可以在桨上提供基本上反射的低发射率内表面,以将来自红外成像模块的红外传感器组件的红外辐射反射回红外传感器组件。

    SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE

    公开(公告)号:US20140184807A1

    公开(公告)日:2014-07-03

    申请号:US14106696

    申请日:2013-12-13

    Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

    Abstract translation: 提供了用于实现红外传感器的分段焦平面阵列(FPA)的各种技术。 在一个示例中,系统包括分段的FPA。 分段FPA包括具有红外传感器阵列(例如辐射热计)的顶模。 顶部管芯还可以包括读出集成电路(ROIC)的一部分。 分段FPA还包括具有至少一部分ROIC的底模。 顶部和底部管芯通过管芯间连接电耦合。 有利地,与常规FPA架构相比,分段FPA可以以更高的产量和更小的占用面积来制造。 此外,可以使用针对每个管芯的不同的半导体工艺来制造分段的FPA。

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