公开(公告)号：US3871018A

公开(公告)日：1975-03-11

申请号：US37717773

申请日：1973-07-09

Applicant: FERRANTI LTD

Inventor： JACKSON SYDNEY ,  TITTERINGTON JOSEPH BELL

IPC: H01L23/047 ,  H01L23/10 ,  H01L23/495 ,  H01L1/10

CPC classification number: H01L23/10 ,  H01L23/047 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/00014

Abstract: A semiconductor package has a sub-assembly unit comprising a lead frame bonded onto a metal support by a composite glass frit layer on the peripheral parts of the support, a semiconductor device is bonded to the support, or to an intermediate member comprising part of the support, and a metal capping member is secured to the lead frame by an adhesive coating on a glass frit base layer on the capping member.

Abstract translation: 半导体封装具有子组件单元，该子组件单元包括通过在支撑体的周边部分上的复合玻璃料层结合到金属支撑体上的引线框架，半导体器件被结合到支撑件或者包括部分 并且金属封盖构件通过在封盖构件上的玻璃料基底层上的粘合剂涂层固定到引线框架。

公开(公告)号：US3869260A

公开(公告)日：1975-03-04

申请号：US35987273

申请日：1973-05-14

Applicant: FERRANTI LTD

Inventor： JACKSON SYDNEY ,  TITTERINGTON JOSEPH BELL

IPC: H01H11/04 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  B32B15/04

CPC classification number: H01H11/04 ,  H01L21/4825 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  Y10T428/12049 ,  Y10T428/12069 ,  Y10T428/12104 ,  Y10T428/12347 ,  Y10T428/12396 ,  Y10T428/12486 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01014

Abstract: In manufacturing a support such as a lead frame for a semiconductor device, alloying material such as gold is selectively applied in sufficient thickness for the device bonding operation to a part only of a supporting member of the support, by impacting an initially-spherical particle of the alloying material onto the selected part by an impacting tool, for example, forming a thermocompression bond, the particle being secured on the selected part either, when of spherical shape, initially by slight impacting under a suction tool, or, after being flattened between a heated, polished surface of the impacting tool and a polished anvil, solely by the impacting tool.

Abstract translation: 在制造诸如用于半导体器件的引线框架的支撑件中，合金材料如金选择性地施加足够的厚度，用于通过冲击初始球形的颗粒的装置接合操作到仅支撑构件的支撑构件的一部分 合金化材料通过冲击工具在所选择的部件上，例如形成热压结合，该颗粒固定在所选择的部件上，当为球形时，最初通过在抽吸工具下轻微冲击，或者在被平坦化之后 冲击工具的加热抛光表面和抛光砧座，仅通过冲击工具。