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公开(公告)号:US09614127B2
公开(公告)日:2017-04-04
申请号:US14902795
申请日:2013-07-05
申请人: EPISTAR CORPORATION
发明人: Chien-Fu Huang , Yao-Ning Chan , Tzu Chieh Hsu , Yi Ming Chen , Hsin-Chih Chiu , Chih-Chiang Lu , Chia-Liang Hsu , Chun-Hsien Chang
CPC分类号: H01L33/62 , H01L25/167 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/385 , H01L33/48 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066
摘要: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 μm; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.
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公开(公告)号:US09461209B2
公开(公告)日:2016-10-04
申请号:US14853511
申请日:2015-09-14
申请人: Epistar Corporation
发明人: Min-Yen Tsai , Chao-Hsing Chen , Tsung-Hsun Chiang , Wen-Hung Chuang , Bo-Jiun Hu , Tzu-Yao Tseng , Jia-Kuen Wang , Kuan-Yi Lee , Yi-Ming Chen , Chun-Yu Lin , Tsung-Hsien Yang , Tzu-Chieh Hsu , Kun-De Lin , Yao-Ning Chan , Chih-Chiang Lu
CPC分类号: H01L33/382 , H01L33/0012 , H01L33/22 , H01L33/387 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要: A semiconductor light-emitting device includes a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a periphery surface surrounding the active layer; a plurality of vias penetrating the semiconductor stack to expose the first semiconductor layer; and a patterned metal layer formed on the plurality of vias and covered the periphery surface of the first semiconductor layer.
摘要翻译: 半导体发光器件包括半导体堆叠,其包括第一半导体层,第二半导体层和在第一半导体层和第二半导体层之间的有源层,其中第一半导体层包括围绕有源层的外围表面; 穿过所述半导体堆叠以暴露所述第一半导体层的多个通孔; 以及形成在所述多个通路上并且覆盖所述第一半导体层的外围表面的图案化金属层。
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公开(公告)号:US20160284939A1
公开(公告)日:2016-09-29
申请号:US15176890
申请日:2016-06-08
申请人: EPISTAR CORPORATION
发明人: Chun-Yu Lin , Yi-Ming Chen , Shih-Chang Lee , Yao-Ning Chan , Tzu-Chieh Hsu
CPC分类号: H01L33/387 , H01L33/06 , H01L33/22 , H01L33/38 , H01L33/405 , H01L33/42 , H01L33/44 , H01L2933/0016 , H01L2933/0025
摘要: An optoelectronic device is provided. The optoelectronic device comprises: an optoelectronic system for emitting light; multiple contact regions on the optoelectronic system and separated from one another; and multiple fingers on the optoelectronic system and opposite to the multiple contact regions; wherein a first contact region in the multiple contact regions is between two adjacent fingers, and a first distance between the first contact region and one of the adjacent fingers is between 5% and 50% of a second distance between the two adjacent fingers.
摘要翻译: 提供了一种光电器件。 光电子器件包括:用于发光的光电子系统; 光电子系统上的多个接触区域并且彼此分离; 和多个手指在光电子系统上并且与多个接触区域相对; 其中所述多个接触区域中的第一接触区域位于两个相邻的指状物之间,并且所述第一接触区域和所述相邻指状物之一之间的第一距离在所述两个相邻指状物之间的第二距离的5%至50%之间。
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公开(公告)号:USD1008198S1
公开(公告)日:2023-12-19
申请号:US29822281
申请日:2022-01-07
申请人: EPISTAR CORPORATION
设计人: Yao-Ning Chan , Tzu-Yun Feng , Yun-Ya Chang
摘要: FIG. 1 is a perspective view of a light-emitting diode device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing is for the purpose of illustrating environmental structure only and forms no part of the claimed design.-
公开(公告)号:USD818974S1
公开(公告)日:2018-05-29
申请号:US29570832
申请日:2016-07-12
申请人: EPISTAR CORPORATION
设计人: Hui-Fang Kao , Tzu-Chieh Hsu , Yao-Ning Chan , Yi-Ming Chen
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公开(公告)号:US09337394B2
公开(公告)日:2016-05-10
申请号:US14554488
申请日:2014-11-26
申请人: Epistar Corporation
发明人: Yi-Ming Chen , Chun-Yu Lin , Tsung-Hsien Yang , Tzu-Chieh Hsu , Kun-De Lin , Yao-Ning Chan , Chih-Chiang Lu
CPC分类号: H01L33/382 , H01L33/08 , H01L33/22 , H01L33/46
摘要: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.
摘要翻译: 半导体发光器件包括半导体叠层,其包括侧面,第一表面和与第一表面相对的第二表面,其中半导体堆叠还包括从第一表面延伸到第二表面的导电通孔; 形成在所述第二表面上的透明导电层; 第一焊盘部分和第二焊盘部分,形成在第一表面上并电连接到半导体堆叠; 以及形成在第一焊盘部分和半导体堆叠之间以及在第二焊盘部分和半导体堆叠之间的绝缘层。
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公开(公告)号:USD944218S1
公开(公告)日:2022-02-22
申请号:US29798333
申请日:2021-07-07
申请人: EPISTAR CORPORATION
设计人: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:USD928104S1
公开(公告)日:2021-08-17
申请号:US29679564
申请日:2019-02-07
申请人: EPISTAR CORPORATION
设计人: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:USD894850S1
公开(公告)日:2020-09-01
申请号:US29673162
申请日:2018-12-12
申请人: EPISTAR CORPORATION
设计人: Chun-Fu Tsai , Yao-Ning Chan , Yi-Tang Lai , Yi-Ming Chen , Shih-Chang Lee
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公开(公告)号:US10461223B2
公开(公告)日:2019-10-29
申请号:US16128604
申请日:2018-09-12
申请人: EPISTAR CORPORATION
发明人: Yung-Fu Chang , Hsin-Chan Chung , Hung-Ta Cheng , Wen-Luh Liao , Shih-Chang Lee , Chih-Chiang Lu , Yi-Ming Chen , Yao-Ning Chan , Chun-Fu Tsai
摘要: A semiconductor device includes a semiconductor stack comprising a surface, and an electrode structure comprises an electrode pad formed on the surface, and the electrode structure further comprises a first extending electrode, a second extending electrode and a third extending electrode connecting to the electrode pad. The first extending electrode is closer to a periphery of the surface than the third extending electrode is, and the second extending electrode is between the first extending electrode and the third extending electrode. From a top view of the semiconductor device, the first extending electrode, the second extending electrode and the third extending electrode respectively include a first curve having a first angle θ1, a second curve having a second angle θ2 and a third curve having a third angle θ3, wherein θ3>θ2>θ1 .
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