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公开(公告)号:US11088298B2
公开(公告)日:2021-08-10
申请号:US16883742
申请日:2020-05-26
申请人: EPISTAR CORPORATION
发明人: Chien-Fu Huang , Chih-Chiang Lu , Chun-Yu Lin , Hsin-Chih Chiu
摘要: The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.
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公开(公告)号:US10553747B2
公开(公告)日:2020-02-04
申请号:US15295226
申请日:2016-10-17
申请人: EPISTAR CORPORATION
发明人: Chih-Chiang Lu , Yi-Ming Chen , Chun-Yu Lin , Ching-Pei Lin , Chung-Hsun Chien , Chien-Fu Huang , Hao-Min Ku , Min-Hsun Hsieh , Tzu-Chieh Hsu
IPC分类号: H01L33/62 , H01L21/683 , H01L33/00
摘要: A semiconductor device comprises a substrate, a first semiconductor unit on the substrate, and an first adhesion structure between the substrate and the first semiconductor unit, and directly contacting the first semiconductor unit and the substrate, wherein the first adhesion structure comprises an adhesion layer and a sacrificial layer, and the adhesion layer and the sacrificial layer are made of different materials, and wherein an adhesion between the first semiconductor unit and the adhesion layer is different from that between the first semiconductor unit and the sacrificial layer.
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公开(公告)号:US10461223B2
公开(公告)日:2019-10-29
申请号:US16128604
申请日:2018-09-12
申请人: EPISTAR CORPORATION
发明人: Yung-Fu Chang , Hsin-Chan Chung , Hung-Ta Cheng , Wen-Luh Liao , Shih-Chang Lee , Chih-Chiang Lu , Yi-Ming Chen , Yao-Ning Chan , Chun-Fu Tsai
摘要: A semiconductor device includes a semiconductor stack comprising a surface, and an electrode structure comprises an electrode pad formed on the surface, and the electrode structure further comprises a first extending electrode, a second extending electrode and a third extending electrode connecting to the electrode pad. The first extending electrode is closer to a periphery of the surface than the third extending electrode is, and the second extending electrode is between the first extending electrode and the third extending electrode. From a top view of the semiconductor device, the first extending electrode, the second extending electrode and the third extending electrode respectively include a first curve having a first angle θ1, a second curve having a second angle θ2 and a third curve having a third angle θ3, wherein θ3>θ2>θ1 .
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公开(公告)号:US10283669B2
公开(公告)日:2019-05-07
申请号:US15643807
申请日:2017-07-07
申请人: EPISTAR CORPORATION
发明人: Hsin-Chih Chiu , Chih-Chiang Lu , Chun-Yu Lin , Ching-Huai Ni , Yi-Ming Chen , Tzu-Chieh Hsu , Ching-Pei Lin
摘要: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.
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公开(公告)号:US09911786B2
公开(公告)日:2018-03-06
申请号:US15472882
申请日:2017-03-29
申请人: Epistar Corporation
发明人: Chiu-Lin Yao , Chih-Chiang Lu
IPC分类号: H01L33/62 , H01L27/15 , H01L33/64 , H01L33/44 , H01L33/38 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/24 , H01L33/22 , H01L33/00 , H01L29/861 , H01L29/20 , H01L29/22 , H01L29/66
CPC分类号: H01L27/15 , H01L25/075 , H01L25/0753 , H01L29/2003 , H01L29/22 , H01L29/6609 , H01L29/66969 , H01L29/861 , H01L33/007 , H01L33/0079 , H01L33/10 , H01L33/22 , H01L33/24 , H01L33/32 , H01L33/385 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
摘要: The present disclosure is to provide an optoelectronic device. The optoelectronic device comprises a heat dispersion substrate; a first connecting layer on the heat dispersion substrate; a diode stack structure comprising a protection layer and a second connecting layer on the protection layer, wherein the protection layer is on the first connecting layer; a light-emitting structure on the diode stack structure, wherein the light-emitting structure comprises a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; and a first electrode electrically connected to the diode stack structure and the light-emitting structure.
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公开(公告)号:US09831384B2
公开(公告)日:2017-11-28
申请号:US14261368
申请日:2014-04-24
申请人: EPISTAR CORPORATION
发明人: Yi-Ming Chen , Hao-Min Ku , Chih-Chiang Lu , Tzu-Chieh Hsu
CPC分类号: H01L33/10 , H01L33/38 , H01L33/405
摘要: This disclosure discloses a light-emitting device. The light-emitting device comprise a light-emitting stack having a first-type semiconductor layer, a second-type semiconductor layer, and an active formed between the first-type semiconductor layer and the second-type semiconductor layer and emitting a light; and a reflective structure formed on the first-type semiconductor layer and having a first interface and a second interface; wherein the critical angle of the light at the first interface is larger than that at the second interface; and wherein the reflective structure ohmically contacts the first-type semiconductor layer at the first interface.
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公开(公告)号:US09735312B2
公开(公告)日:2017-08-15
申请号:US14442319
申请日:2013-07-03
申请人: EPISTAR CORPORATION
发明人: Hsin-Chih Chiu , Chih-Chiang Lu , Chun-Yu Lin , Ching-Huai Ni , Yi-Ming Chen , Tzu-Chieh Hsu , Ching-Pei Lin
IPC分类号: H01L33/02 , H01L25/075 , H01L33/00 , H01L33/38 , H01L33/46 , H01L33/62 , H01L33/22 , H01L21/00
CPC分类号: H01L33/0025 , H01L21/00 , H01L25/0753 , H01L33/0062 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/382 , H01L33/387 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: A method of manufacturing a semiconductor light-emitting device, comprises the steps of providing a first substrate; providing multiple epitaxial units on the first substrate, wherein the plurality of epitaxial units comprises: multiple first epitaxial units, wherein each of the first epitaxial units has a first geometric shape and a first area; and multiple second epitaxial units, wherein each of the second epitaxial units has a second geometric shape and a second area; providing a second substrate with a surface; transferring the multiple second epitaxial units to the surface of the second substrate; and dividing the first substrate to form multiple first semiconductor light-emitting devices, wherein each of the first semiconductor light-emitting devices has the first epitaxial unit; wherein the first geometric shape is different from the second geometric shape, or the first area is different from the second area.
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公开(公告)号:US09269870B2
公开(公告)日:2016-02-23
申请号:US14038969
申请日:2013-09-27
申请人: EPISTAR CORPORATION
发明人: Chien-Fu Huang , Shiuan-Leh Lin , Chih-Chiang Lu , Chia-Liang Hsu
CPC分类号: H01L33/12 , H01L33/0079 , H01L33/02 , H01L33/10 , H01L33/22 , H01L33/30 , H01L33/32 , H01L33/46 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0091
摘要: This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer formed on the substrate; a transparent bonding layer; a first semiconductor window layer bonded to the semiconductor layer through the transparent bonding layer; and a light-emitting stack formed on the first semiconductor window layer. The intermediate layer has a refractive index between the refractive index of the substrate and the refractive index of the first semiconductor window layer.
摘要翻译: 本公开公开了一种发光装置。 发光装置包括:基板; 形成在所述基板上的中间层; 透明结合层; 通过透明结合层与半导体层接合的第一半导体窗口层; 以及形成在第一半导体窗口层上的发光叠层。 中间层具有基板的折射率与第一半导体窗口层的折射率之间的折射率。
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公开(公告)号:US08932885B2
公开(公告)日:2015-01-13
申请号:US13730130
申请日:2012-12-28
申请人: Epistar Corporation
发明人: Min-Hsun Hsieh , Kuen-Ru Chuang , Shu-Wen Sung , Chia-Cheng Liu , Chao-Nien Huang , Shane-Shyan Wey , Chih-Chiang Lu , Ming-Jiunn Jou
CPC分类号: H01L33/16 , H01L21/2007 , H01L33/0079 , H01L33/02 , H01L33/30 , H01L33/32 , H01L33/42
摘要: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
摘要翻译: 一种具有透明基板的发光二极管及其制造方法。 发光二极管通过产生两个半导体多层并结合而形成。 第一半导体多层形成在非透明基板上。 通过在透明基板上形成非晶界面层来形成第二半导体多层。 将两个半导体多层结合,并且去除非透明衬底,留下具有透明衬底的半导体多层。
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公开(公告)号:US20220131029A1
公开(公告)日:2022-04-28
申请号:US17570206
申请日:2022-01-06
申请人: EPISTAR CORPORATION
发明人: Hsin-Chih Chiu , Chih-Chiang Lu , Chun-Yu Lin , Ching-Huai Ni , Yi-Ming Chen , Tzu-Chieh Hsu , Ching-Pei Lin
摘要: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.
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