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公开(公告)号:USD944218S1
公开(公告)日:2022-02-22
申请号:US29798333
申请日:2021-07-07
申请人: EPISTAR CORPORATION
设计人: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:USD928104S1
公开(公告)日:2021-08-17
申请号:US29679564
申请日:2019-02-07
申请人: EPISTAR CORPORATION
设计人: Hui-Fang Kao , Yao-Ning Chan , Hao-Chun Liang , Shih-Chang Lee
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公开(公告)号:US12002906B2
公开(公告)日:2024-06-04
申请号:US17406521
申请日:2021-08-19
申请人: EPISTAR CORPORATION
发明人: Hao-Chun Liang , Wei-Shan Yeoh , Yao-Ning Chan , Yi-Ming Chen , Shih-Chang Lee
IPC分类号: H01L33/44 , H01L31/02 , H01L31/0216 , H01L31/0352 , H01L33/20 , H01L33/46 , H01L33/62 , H01L31/0224 , H01L33/38
CPC分类号: H01L33/44 , H01L31/02005 , H01L31/02161 , H01L31/035272 , H01L33/20 , H01L33/46 , H01L33/62 , H01L31/022408 , H01L33/38
摘要: The present disclosure provides a semiconductor device and a semiconductor component. The semiconductor device includes an active structure, a ring-shaped semiconductor contact layer, a first electrode, and an insulating layer. The active structure has a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer located between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer. The ring-shaped semiconductor contact layer is located on the second-conductivity-type semiconductor layer and having a first inner sidewall and a first outer sidewall. The first electrode has an upper surface and covers the ring-shaped semiconductor contact layer. The insulating layer covers the first electrode and the active structure and has a second inner sidewall and a second outer sidewall. The first inner sidewall is not flush with the second inner sidewall in a vertical direction.
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公开(公告)号:US20220059727A1
公开(公告)日:2022-02-24
申请号:US17406521
申请日:2021-08-19
申请人: EPISTAR CORPORATION
发明人: Hao-Chun Liang , Wei-Shan Yeoh , Yao-Ning Chan , Yi-Ming Chen , Shih-Chang Lee
IPC分类号: H01L33/44 , H01L33/46 , H01L33/20 , H01L31/0216 , H01L31/0352 , H01L33/62 , H01L31/02
摘要: The present disclosure provides a semiconductor device and a semiconductor component. The semiconductor device includes an active structure, a ring-shaped semiconductor contact layer, a first electrode, and an insulating layer. The active structure has a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer located between the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer. The ring-shaped semiconductor contact layer is located on the second-conductivity-type semiconductor layer and having a first inner sidewall and a first outer sidewall. The first electrode has an upper surface and covers the ring-shaped semiconductor contact layer. The insulating layer covers the first electrode and the active structure and has a second inner sidewall and a second outer sidewall. The first inner sidewall is not flush with the second inner sidewall in a vertical direction.
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