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    Optical module
    4.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US09411097B2

    公开(公告)日：2016-08-09

    申请号：US14727751

    申请日：2015-06-01

    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

    Inventor： Young Tak Han ,  Sang Ho Park ,  Yong Soon Baek ,  Jang Uk Shin

    IPC: G02B6/12 ,  G02B6/36

    CPC classification number: G02B6/12019 ,  G02B6/4251 ,  G02B6/4279

    Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards inside the metal package through the lower slit and is secured to an upper portion of the silicon carrier, and the upper slit and the lower slit of the double slit being sealed by an elastic epoxy.

    Abstract translation: 本文提供了一种光学模块，其包括具有第一深度的第一步骤和具有小于第一深度的第二深度的第二步骤的光学台架; 设置在所述第一台阶上方的硅载体，并且其中安装有至少一个半导体芯片; 固定到第二步的AWG芯片（阵列波导光栅芯片）延伸到第一步，并且在第一步骤之上与硅载体进行芯片到芯片的接合; 透镜，设置在光学台的上表面，其中没有形成第一步骤和第二步骤; 以及围绕光学台，硅载体，AWG芯片和透镜的金属封装，其中在金属封装的一侧形成包括上缝和下缝的双缝，DC FPCB（直流FPCB）延伸 从金属包装的外部通过上部狭缝固定到形成在上部狭缝的内表面上的支撑件上，并且RF FPCB（射频FPCB）通过下部狭缝从外部向金属包装内部延伸，并且是 固定到硅载体的上部，双缝的上缝和下狭缝由弹性环氧树脂密封。

    Optical devices and methods of fabricating the same
    10.
    发明授权
    Optical devices and methods of fabricating the same 有权
    光学器件及其制造方法

    公开(公告)号：US09335474B2

    公开(公告)日：2016-05-10

    申请号：US14311372

    申请日：2014-06-23

    Applicant: Electronics and Telecommunications Research Institute

    Inventor： Young-Tak Han ,  Sang Ho Park ,  Dong-Hun Lee ,  Jang Uk Shin ,  Sang-Pil Han ,  Yongsoon Baek

    IPC: G02B6/136 ,  G02B6/42 ,  G02B6/12 ,  H01L23/00

    CPC classification number: G02B6/136 ,  G02B6/423 ,  G02B6/4231 ,  G02B2006/12176 ,  H01L24/11 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/00

    Abstract: Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.

    Abstract translation: 提供了一种光学装置。 光学装置包括具有波导区域和安装区域的基板，在基板的波导区域上包括下覆盖层和上覆盖层的平面光波导路（PLC）波导和位于基板的波导区域之间的平台铁心， 包覆层和上包层，通过蚀刻衬底的安装区域上的下包覆层限定的平台，所述露台包括互锁部分，安装在衬底的安装区域上的光学有源芯片，光学活动 芯片，其中包括芯片芯片，以及设置在光学有源芯片的安装表面上的芯片对准标记。 光学有源芯片通过在平台的互锁部分和光学有源芯片的芯片对准标记之间的互锁对准并且安装在安装区域上。

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