公开(公告)号：US20160240494A1

公开(公告)日：2016-08-18

申请号：US15045816

申请日：2016-02-17

Applicant: Electronics and Telecommunications Research Institute

Inventor： Myunghoi KIM

IPC: H01L23/66 ,  H01L21/50 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/057 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2223/6655 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Disclosed is a method of improving performance and increasing a freedom degree of design of an interconnect structure in a radio frequency (RF) package. The RF package may include a package base, a semiconductor die mounted on the package base, a package substrate formed on the package base, the package substrate comprising at least one defected substrate structure (DSS), and a conducting pattern formed on one side of the package substrate and electrically connected with the semiconductor die, wherein the at least one DSS overlaps at least a portion of the conducting pattern in perspective of a top view of the RF package.

Abstract translation: 公开了一种提高射频（RF）封装中的互连结构的性能和提高自由度设计的方法。 RF封装可以包括封装基座，安装在封装基座上的半导体管芯，形成在封装基座上的封装衬底，封装衬底包括至少一个缺陷衬底结构（DSS）和形成在 所述封装衬底并与所述半导体管芯电连接，其中所述至少一个DSS在所述RF封装的俯视图的透视图中与所述导电图案的至少一部分重叠。

公开(公告)号：US20140225681A1

公开(公告)日：2014-08-14

申请号：US13932811

申请日：2013-07-01

Applicant: Electronics and Telecommunications Research Institute

Inventor： Myunghoi KIM ,  Jin Ho JO ,  Jae Hoon KIM

IPC: H03H7/01 ,  H01P11/00

CPC classification number: H01P11/007 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  Y10T29/4902

Abstract: An electromagnetic bandgap structure is provided, which includes a ground layer; a first power layer facing an upper portion of the ground layer with a dielectric interposed and comprising at least one first patch and at least one first branch; and a second power layer facing an upper portion of the first power layer with a dielectric interposed and comprising at least one second patch and at least one second branch.

Abstract translation: 提供电磁带隙结构，其包括接地层; 面向所述接地层的上部的第一电力层，其中电介质插入并且包括至少一个第一贴片和至少一个第一支路; 以及面向所述第一功率层的上部的第二功率层，具有电介质，并且包括至少一个第二贴片和至少一个第二支线。