公开(公告)号：US10819326B1

公开(公告)日：2020-10-27

申请号：US16699379

申请日：2019-11-29

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yil Suk Yang ,  Hyun Joong Lee ,  Chang Han Je ,  Jong Dae Kim

IPC: H03K5/135 ,  H03K3/017 ,  H03K5/00 ,  H03K5/133

Abstract: The present invention relates to a digital clock generation apparatus. The digital clock generation apparatus is directed to providing a digital clock generation apparatus in which hardware is simple, duty cycles are easily controlled, and various duty cycles and various frequency clocks (n× clocks) are provided as compared to a 1× single-phase clock generation apparatus or a 1× multi-phase clock generation apparatus based on the conventional programmable delay element chain.

公开(公告)号：US09219971B2

公开(公告)日：2015-12-22

申请号：US13671502

申请日：2012-11-07

Applicant: Electronics and Telecommunications Research Institute

Inventor： Hye Jin Kim ,  Sung Q Lee ,  Hong Yeol Lee ,  Kang Ho Park ,  Jong Dae Kim ,  Kun Mo Koo

IPC: H04R17/00 ,  H04R31/00 ,  H04R1/02 ,  H04R17/02 ,  H01L41/29 ,  H04R17/10 ,  H01L41/22 ,  H03H9/17

CPC classification number: H04R31/006 ,  H01L41/22 ,  H01L41/29 ,  H03H9/174 ,  H04R1/02 ,  H04R17/00 ,  H04R17/02 ,  H04R17/10 ,  H04R31/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49115

Abstract: A method of manufacturing a piezoelectric speaker comprises forming a piezoelectric thin film and then forming an upper electrode and a lower electrode on and beneath the piezoelectric thin film, respectively, forming a damping material layer for attachment of the piezoelectric thin film below the piezoelectric thin film with the upper and lower electrodes formed thereon and therebeneath, attaching the piezoelectric thin film to an acoustic diaphragm in an inclined structure in which the piezoelectric thin film is horizontally turned from the acoustic diaphragm, and performing drying at room temperature; and fixing the acoustic diaphragm to a frame using an adhesive material with high elasticity.

Abstract translation: 一种制造压电扬声器的方法包括：分别形成压电薄膜，然后在压电薄膜上下形成上电极和下电极，形成用于将压电薄膜连接到压电薄膜下面的阻尼材料层 其上面和下部电极形成在其上并在其下面，将压电薄膜以声学振膜的倾斜结构粘附到声学振膜中，其中压电薄膜从声膜水平转动，并在室温下进行干燥; 并使用高弹性的粘合材料将声膜固定在框架上。

公开(公告)号：US08605920B2

公开(公告)日：2013-12-10

申请号：US13791039

申请日：2013-03-08

Applicant: Electronics and Telecommunications Research Institute

Inventor： Hye Jin Kim ,  Sung Q Lee ,  Kang Ho Park ,  Jong Dae Kim

IPC: H01L25/00

CPC classification number: H04R31/003 ,  H04R19/005 ,  H04R31/00 ,  H04R2499/11

Abstract: A condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer on the first insulating layer; forming sound holes by patterning the upper silicon layer; forming a second insulating layer and a conductive layer on the upper silicon layer; forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the layers to form an air gap between the diaphragm and the upper silicon layer. Consequently, a manufacturing process may improve the sensitivity and reduce the size of the condenser microphone.

Abstract translation: 提供一种具有挠性铰链膜片的电容麦克风及其制造方法。 该方法包括以下步骤：形成下硅层和第一绝缘层; 在所述第一绝缘层上形成上硅层; 通过图案化上硅层形成声孔; 在上硅层上形成第二绝缘层和导电层; 在导电层上形成钝化层; 在钝化层上形成牺牲层; 在牺牲层上沉积隔膜，并形成穿过隔膜的气孔; 在所述钝化层上形成电极焊盘和所述隔膜的区域; 并蚀刻各层以在隔膜和上硅层之间形成气隙。 因此，制造工艺可以提高电容传声器的灵敏度和减小尺寸。