Method for manufacturing light-emitting element

    公开(公告)号:US09966498B2

    公开(公告)日:2018-05-08

    申请号:US15149837

    申请日:2016-05-09

    IPC分类号: H01L33/00 H01L33/46 H01L33/20

    摘要: A method for manufacturing a light-emitting element, including steps of: providing a wafer-level element including a wafer and a light-emitting stack on the wafer, wherein the wafer including an upper surface and a bottom surface, and light-emitting stack is formed on the upper surface of the wafer; forming a light-emitting stack on the upper surface of the wafer; cutting the wafer from one of the bottom surface or the top surface of the wafer by a water-jet laser having a first beam size; cutting the wafer from the other one of the bottom surface or the upper surface of the wafer by the water-jet laser having a second beam size; and dividing the wafer-level element wafer and the light-emitting stack into a plurality of light-emitting dies.

    LIGHT-EMITTING ELEMENT
    8.
    发明申请

    公开(公告)号:US20190074409A1

    公开(公告)日:2019-03-07

    申请号:US16182241

    申请日:2018-11-06

    摘要: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.