公开(公告)号：US20240162068A1

公开(公告)日：2024-05-16

申请号：US18387734

申请日：2023-11-07

Applicant: ENTEGRIS, INC.

Inventor： Jack Dunlope ,  Christopher Strickhouser ,  Matthew A. Fuller ,  Colton J. Harr

IPC: H01L21/673 ,  H01L21/687

CPC classification number: H01L21/67326 ,  H01L21/6732 ,  H01L21/6875 ,  H01L21/68785

Abstract: A semiconductor substrate carrying container, such as a front opening unified pod or shipping box, that includes a container shell having a plurality of walls, a front, and a rear, the plurality of walls defining an interior space that is sized to be able to receive a plurality of semiconductor substrates or trays, and a support structure configured to receive the plurality of semiconductor substrates or trays. The support structure includes at least one support wall that is formed by a plurality of corrugation portions provided along opposite sides of a centerline along a vertical plane at a center of the at least one support wall.

公开(公告)号：US20230307275A1

公开(公告)日：2023-09-28

申请号：US18125604

申请日：2023-03-23

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Wei Sheng Hsu ,  Kobold Yang ,  Colton J. Harr

IPC: H01L21/673

CPC classification number: H01L21/67393 ,  H01L21/67376

Abstract: A purge port assembly for a wafer container includes a purge module configured to allow inlet flow of purge gas and a transition portion disposed over an intermediate outlet of the purge module. The transition portion includes a receiver configured to receive the purge gas discharged from the purge module, an outlet connector configured to attach with a diffuser, and an intermediate conduit. The intermediate conduit connects the receiver to the outlet connector and extends from the receiver at an acute angle relative to an axis of the inlet opening of the receiver. The intermediate conduit has a length that spaces apart the outlet connector from the receiver. A wafer container includes a shell and a purge port assembly. The shell includes an interior space. The purge port assembly extends through an opening in the shell into the interior space.

公开(公告)号：US20200168492A1

公开(公告)日：2020-05-28

申请号：US16074850

申请日：2017-02-03

Applicant: Matthew FULLER ,  Colton J. HARR ,  ENTEGRIS, Inc.

Inventor： Matthew A. Fuller ,  Colton J. Harr

IPC: H01L21/673

Abstract: A substrate retainer (110) is provided which presents a substantially uniform contact face (128) that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face (128) is allowed to deflect and compress in order to eliminates the prospect of substrates (114) being damaged by or becoming inadvertently pinched within the substrate retainer (110) or from being pressed too hard by the uniform contact face (128). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.

公开(公告)号：US20230411192A1

公开(公告)日：2023-12-21

申请号：US18200965

申请日：2023-05-23

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Colton J. Harr

IPC: H01L21/673

CPC classification number: H01L21/67393 ,  H01L21/67386 ,  F16K27/0209 ,  H01L21/67369 ,  H01L21/67376

Abstract: A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).

公开(公告)号：US20230245908A1

公开(公告)日：2023-08-03

申请号：US18105119

申请日：2023-02-02

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Mark V. Smith ,  Colton J. Harr

IPC: H01L21/673 ,  G05D7/06

CPC classification number: H01L21/67389 ,  G05D7/0635

Abstract: A system is provided. The system includes a substrate container having at least two purge modules. Each purge module of the at least two purge modules includes a flow control device. The flow control device of each purge module is configured to be actuated for egress of a purge fluid. A method of actuating flow control devices of purge modules of a substrate container is provided. The method includes starting a purge process of the substrate container; streaming a purge fluid into an interior of the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module being configured to be actuated for egress of the purge fluid; and actuating the flow control device for egress of the purge fluid.

公开(公告)号：US20240274454A1

公开(公告)日：2024-08-15

申请号：US18438258

申请日：2024-02-09

Applicant: ENTEGRIS, INC.

Inventor： Ryan Madhu Jacob ,  Matthew A. Fuller ,  Mark V. Smith ,  Aleksandr Anatoliyvich Yakuba ,  Colton J. Harr

IPC: H01L21/673

CPC classification number: H01L21/67389

Abstract: Described are support devices that are useful with substrate containers used to hold or transport substrates in a clean environment, as well as associated systems and methods of using the support devices and substrate containers.

公开(公告)号：US20240222172A1

公开(公告)日：2024-07-04

申请号：US18398065

申请日：2023-12-27

Applicant: ENTEGRIS, INC.

Inventor： Mark V. Smith ,  Matthew A. Fuller ,  Colton J. Harr ,  Thomas H. Wilkie ,  Shawn D. Eggum ,  Aleksandr Yakuba

IPC: H01L21/673

CPC classification number: H01L21/67386

Abstract: Described are wafer containers adapted to store or transport semiconductor wafers in a clean environment, including containers that include a purge gas delivery device, as well as methods for purging the environment within the container.

公开(公告)号：US20230377925A1

公开(公告)日：2023-11-23

申请号：US18229063

申请日：2023-08-01

Applicant: ENTEGRIS, INC.

Inventor： Mark V. Smith ,  Thomas H. Wilkie ,  Colton J. Harr ,  Matthew A. Fuller ,  Shawn D. Eggum ,  Michael C. Zabka

IPC: H01L21/673

CPC classification number: H01L21/67393 ,  H01L21/6732

Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

公开(公告)号：US20250149363A1

公开(公告)日：2025-05-08

申请号：US18935313

申请日：2024-11-01

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Colton J. Harr ,  Paul J. Magoon ,  Rocky Dean Gipson ,  Gary Gallagher

IPC: H01L21/673 ,  H01L21/67

Abstract: Described are methods and apparatus that are useful to for purifying a substrate container that is used to hold, store, or transport semiconductor substrates.

公开(公告)号：US20230131451A1

公开(公告)日：2023-04-27

申请号：US17972093

申请日：2022-10-24

Applicant: ENTEGRIS, INC.

Inventor： Matthew A. Fuller ,  Mark V. Smith ,  Shawn D. Eggum ,  Thomas H. Wilkie ,  Colton J. Harr ,  Michael C. Zabka

IPC: H01L21/677 ,  H01L21/67

Abstract: Substrate containers include purge flow distribution systems. The purge flow distribution systems can divide one or more input flows of purge gas to a plurality of gas distribution surfaces of a network of gas distribution devices. Methods of controlling purge can include configuring the substrate containers to provide determined purge gas flow rates at each of the gas distribution surfaces. The configuration can be performed using flow controls of the purge flow distribution systems. The purge gas flow rates can be determined based on purge performance parameters. A controller can direct the operation of the purge flow distribution systems. The controller and the substrate container can be combined in a substrate container purging system.