公开(公告)号：US11230789B2

公开(公告)日：2022-01-25

申请号：US16685038

申请日：2019-11-15

Applicant: EBARA CORPORATION

Inventor： Masaya Seki ,  Hideki Takayanagi ,  Kiyoshi Suzuki ,  Masayuki Satake ,  Jumpei Fujikata

IPC: C25D7/12 ,  C25D17/00 ,  C25D21/12

Abstract: A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.

公开(公告)号：US11604150B2

公开(公告)日：2023-03-14

申请号：US17256921

申请日：2019-06-27

Applicant: EBARA CORPORATION

Inventor： Takahisa Okuzono ,  Masaki Tomita ,  Jumpei Fujikata ,  Hideki Takayanagi

IPC: G01N21/95 ,  G01B11/06 ,  G01N21/45 ,  H01L23/00

Abstract: An object is to allow for simple measurement of a bump height. There is provided a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

公开(公告)号：US20190390359A1

公开(公告)日：2019-12-26

申请号：US16451387

申请日：2019-06-25

Applicant: EBARA CORPORATION

Inventor： Masaya Seki ,  Hideki Takayanagi ,  Kiyoshi Suzuki ,  Masayuki Satake ,  Jumpei Fujikata

IPC: C25D17/08 ,  C25D17/00

Abstract: To reduce an amount of plating solution attached to a substrate holder.There is provided the substrate holder for holding a substrate comprising a first holding member, a second holding member, a sealing member, a pin, a ring, and a moving mechanism. The sealing member forms a sealed space inside the substrate holder. The pin is fixed to one of the first holding member and the second holding member. The ring is disposed on another of the first holding member and the second holding member. The ring engages with the pin. The moving mechanism circumferentially moves the ring. The pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another. The pin and the ring are disposed inside the sealed space.

公开(公告)号：US11535949B2

公开(公告)日：2022-12-27

申请号：US16451387

申请日：2019-06-25

Applicant: EBARA CORPORATION

Inventor： Masaya Seki ,  Hideki Takayanagi ,  Kiyoshi Suzuki ,  Masayuki Satake ,  Jumpei Fujikata

IPC: C25D17/08 ,  C25D17/00 ,  C25D17/06

Abstract: There is provided the substrate holder for holding a substrate comprising a first holding member, a second holding member, a sealing member, a pin, a ring, and a moving mechanism. The sealing member forms a sealed space inside the substrate holder. The pin is fixed to one of the first holding member and the second holding member. The ring is disposed on another of the first holding member and the second holding member. The ring engages with the pin. The moving mechanism circumferentially moves the ring. The pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another. The pin and the ring are disposed inside the sealed space.

公开(公告)号：US20210285893A1

公开(公告)日：2021-09-16

申请号：US17256921

申请日：2019-06-27

Applicant: EBARA CORPORATION

Inventor： Takahisa Okuzono ,  Masaki Tomita ,  Jumpei Fujikata ,  Hideki Takayanagi

IPC: G01N21/95 ,  G01N21/45 ,  G01B11/06 ,  H01L23/00

Abstract: An object is to allow for simple measurement of a bump height. There is provided. a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.