Invention Grant
- Patent Title: Substrate holder and plating apparatus
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Application No.: US16451387Application Date: 2019-06-25
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Publication No.: US11535949B2Publication Date: 2022-12-27
- Inventor: Masaya Seki , Hideki Takayanagi , Kiyoshi Suzuki , Masayuki Satake , Jumpei Fujikata
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker Hostetler LLP
- Priority: JPJP2018-119875 20180625
- Main IPC: C25D17/08
- IPC: C25D17/08 ; C25D17/00 ; C25D17/06

Abstract:
There is provided the substrate holder for holding a substrate comprising a first holding member, a second holding member, a sealing member, a pin, a ring, and a moving mechanism. The sealing member forms a sealed space inside the substrate holder. The pin is fixed to one of the first holding member and the second holding member. The ring is disposed on another of the first holding member and the second holding member. The ring engages with the pin. The moving mechanism circumferentially moves the ring. The pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another. The pin and the ring are disposed inside the sealed space.
Public/Granted literature
- US20190390359A1 SUBSTRATE HOLDER AND PLATING APPARATUS Public/Granted day:2019-12-26
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