公开(公告)号：US11655369B2

公开(公告)日：2023-05-23

申请号：US17439855

申请日：2020-10-28

Applicant: Dow Silicones Corporation

Inventor： Dorab Bhagwagar ,  Peng Wei ,  Qianqing Ge ,  Yan Zheng ,  Zhanjie Li

IPC: C08L83/04 ,  C08K3/013

CPC classification number: C08L83/04 ,  C08K3/013 ,  C08K2201/001

Abstract: A composition contains an organopolysiloxane having the average chemical structure (I):

[R′R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3  (I)

where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

公开(公告)号：US20230257582A1

公开(公告)日：2023-08-17

申请号：US18004077

申请日：2020-09-23

Applicant: Dow Global Technologies LLC ,  Dow Silicones Corporation

Inventor： Jiguang Zhang ,  Yan Zheng ,  Chao He ,  Xuedong Gao ,  Qianqing Ge ,  Dorab Bhagwagar ,  Peng Wei ,  Chen Chen ,  Hongyu Chen

IPC: C08L83/04 ,  C08K5/5419 ,  C08K3/22

CPC classification number: C08L83/04 ,  C08K5/5419 ,  C08K3/22 ,  C08K2201/001 ,  C08K2003/2296 ,  C08K2003/0812

Abstract: Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

公开(公告)号：US20240279525A1

公开(公告)日：2024-08-22

申请号：US18566121

申请日：2021-08-19

Applicant: Dow Silicones Corporation

Inventor： Yan Zheng ,  Dorab Bhagwagar ,  Qianqing Ge ,  Peng Wei ,  Han Guang Wu

IPC: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  C08K3/28 ,  C08K7/18 ,  C08K9/08 ,  C08K13/06 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K13/06 ,  H05K7/2039 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K7/18 ,  C08K9/08 ,  C08K2201/001 ,  C08K2201/005

Abstract: A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt % of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt % of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt % of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt %; and where wt % values are relative to the weight of the thermally conductive composition unless otherwise stated.

公开(公告)号：US20230212447A1

公开(公告)日：2023-07-06

申请号：US18005678

申请日：2020-10-28

Applicant: Dow Silicones Corporation

Inventor： Dorab Bhagwagar ,  Cassie Hale ,  Peng Wei ,  Qianqing Ge ,  Yan Zheng ,  Zhanjie Li

IPC: C09K5/14 ,  C08K7/18 ,  C08K3/22 ,  C08G77/12 ,  C08G77/22 ,  C08G77/08

CPC classification number: C09K5/14 ,  C08K7/18 ,  C08K3/22 ,  C08G77/12 ,  C08G77/22 ,  C08G77/08 ,  C08K2003/0812

Abstract: A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

公开(公告)号：US11732175B2

公开(公告)日：2023-08-22

申请号：US18005678

申请日：2020-10-28

Applicant: Dow Silicones Corporation

Inventor： Dorab Bhagwagar ,  Cassie Hale ,  Peng Wei ,  Qianqing Ge ,  Yan Zheng ,  Zhanjie Li

IPC: C09K5/14 ,  C08K7/18 ,  C08K3/22 ,  C08G77/12 ,  C08G77/22 ,  C08G77/08 ,  C08K3/08

CPC classification number: C09K5/14 ,  C08G77/08 ,  C08G77/12 ,  C08G77/22 ,  C08K3/22 ,  C08K7/18 ,  C08K2003/0812 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014

Abstract: A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

公开(公告)号：US20230090031A1

公开(公告)日：2023-03-23

申请号：US17439855

申请日：2020-10-28

Applicant: Dow Silicones Corporation

Inventor： Dorab Bhagwagar ,  Peng Wei ,  Qianqing Ge ,  Yan Zheng ,  Zhanjie Li

IPC: C08L83/04 ,  C08K3/013

Abstract: A composition contains an organopolysiloxane having the average chemical structure (I): [R′R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3  (I) where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

公开(公告)号：US20220289936A1

公开(公告)日：2022-09-15

申请号：US17761360

申请日：2019-12-05

Applicant: Dow Silicones Corporation

Inventor： Yan Zheng ,  Chen Chen ,  Dorab Bhagwagar ,  Peng Wei ,  Qianqing Ge

IPC: C08K3/22 ,  C08G77/04 ,  C08K3/28

Abstract: A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.