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公开(公告)号：US11938709B2
公开(公告)日：2024-03-26
申请号：US17047922
申请日：2019-05-15
发明人： Luis Alberto Santini , Radisa Boskovic , Peter Hermann Roland Sandkuehler , Ramon Pradas Cortina , Marti Nogué I Arbusa , Carlos Almor Morujo
IPC分类号： B32B37/04 , B29C65/00 , B29C65/02 , B32B27/08 , B32B27/30 , B32B27/32 , B32B27/34 , B32B37/18 , B65D47/06
CPC分类号： B32B37/04 , B29C65/02 , B29C66/723 , B32B27/08 , B32B27/306 , B32B27/32 , B32B27/34 , B32B37/185 , B65D47/06 , B32B2250/05 , B32B2250/24 , B32B2307/30 , B32B2307/518 , B32B2307/72 , B32B2323/043 , B32B2323/046 , B32B2323/10 , B32B2329/04 , B32B2377/00
摘要： The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112 C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15 C higher than the sealant layer.
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公开(公告)号：US20210162728A1
公开(公告)日：2021-06-03
申请号：US17047922
申请日：2019-05-15
发明人： Luis Alberto Santini , Radisa Boskovic , Peter Hermann Roland Sandkuehler , Ramon Pradas Cortina , Marti Nogué I Arbusa , Carlos Almor Morujo
摘要： The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112 C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15 C higher than the sealant layer.
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