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公开(公告)号：US07372698B1
公开(公告)日：2008-05-13
申请号：US11614483
申请日：2006-12-21
CPC分类号： H05K7/20836 , H05K7/20772
摘要： An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.
摘要翻译： 一种用于热管理计算机服务器的电子设备和从计算机服务器发出的废气的电子设备热交换器系统。 电子设备热交换器系统通常包括附接在用于支撑架的支撑单元的空气出口附近的热交换器，流体连接到热交换器的热管理单元和流体连接到热管理单元的热调节单元 热交换器。 热管理单元直接热管理服务器主板的一个或多个电子设备，而热交换器在排气通过计算机服务器的支撑单元的出口排出之前热管理废气。
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公开(公告)号：US07836706B2
公开(公告)日：2010-11-23
申请号：US10260713
申请日：2002-09-27
IPC分类号： F25D17/02
CPC分类号： F28D5/00 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.
摘要翻译： 一种热管理系统，其配置为使单个和多个雾化器的潜力最大化以有效地冷却微处理器和其它电子设备。 可以是散热器的热管理系统提供了被设置为增加冲击冷却剂液滴的有效性的表面，在一些实施例中提供额外的传热面积，并且允许对受体物体的有效，定制和不同的热管理 热管理。
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公开(公告)号：US20070193721A1
公开(公告)日：2007-08-23
申请号：US11466076
申请日：2006-08-21
CPC分类号： F25B43/04 , F28D15/0258 , F28D15/0266 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A two-phase liquid cooling system includes an active venting system for regulating an amount of non-condensable gas within the cooling system. Various venting structures may be used to remove gases from the cooling system, some of which are designed to remove the non-condensable gases and avoid removing the vapor-phase coolant. A control system activates the venting system to achieve a desired pressure, which may be based on measured process conditions within the cooling system. A venting and refilling system may serve multiple cooling systems in a parallel arrangement.
摘要翻译： 两相液体冷却系统包括用于调节冷却系统内的不可冷凝气体量的主动排放系统。 可以使用各种排气结构来从冷却系统中除去气体，其中一些设计用于去除不可冷凝气体并避免去除气相冷却剂。 控制系统激活排气系统以实现所需的压力，其可以基于冷却系统内测量的工艺条件。 排气和再填充系统可以以并行布置服务多个冷却系统。
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公开(公告)号：US07078803B2
公开(公告)日：2006-07-18
申请号：US10292073
申请日：2002-11-12
IPC分类号： H05K7/20 , H01L23/473 , H01L23/34
CPC分类号： F28D5/00 , H01L23/4336 , H01L23/4735 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.
摘要翻译： 一种集成电路散热系统，用于减少封装集成电路中的接点数量，从而降低热阻抗并增加散热效率。 集成电路散热系统包括附接到基板的盖子，围绕盖子附接的盖子，形成散热室，以及通过导热粘合剂附接到盖子的半导体芯片。 取决于所使用的衬底，盖子可以或可以不形成围绕半导体芯片的空腔。 盖子优选地包括从其限定多个通道或多个槽的多个翅片，从而增加盖子的热通量。
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公开(公告)号：US5314529A
公开(公告)日：1994-05-24
申请号：US119619
申请日：1993-09-13
CPC分类号： B01D45/16
摘要： An apparatus for separating liquid from a liquid/gas mixture by establishing a laminar flow within a curved channel. Entrained liquid droplets, that have higher inertia than the gas, follow a trajectory, deviate from the gas flow lines, and impinge on the wall. The liquid droplets coalesce and migrate to the inner radius under the influence of shear from the secondary flow, where the liquid is collected and retained in an artery by capillary action. The liquid is then forced through bleed ports into the liquid drain line. The term liquid/gas mixtures is intended to include liquid/vapor mixtures as well.
摘要翻译： 一种用于通过在弯曲通道内建立层流来从液体/气体混合物中分离液体的装置。 具有比气体更高的惯性的夹带的液滴跟随轨迹，偏离气体流动线并撞击在壁上。 液滴在来自二次流动的剪切力的影响下聚结并迁移到内半径，其中通过毛细管作用将液体收集并保留在动脉中。 然后将液体强制通过排放口进入排液管线。 术语液体/气体混合物也用于包括液体/蒸气混合物。
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公开(公告)号：US07788939B2
公开(公告)日：2010-09-07
申请号：US11183333
申请日：2005-07-16
申请人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
IPC分类号： F25D23/12
CPC分类号： C09K5/041 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.
摘要翻译： 一种共沸喷雾冷却系统，用于利用共沸冷却剂来改善喷雾冷却系统的性能。 在用于热管理一个或多个发热装置的两相热管理系统中使用共沸冷却剂。 可以通过改变共沸冷却剂的组分来调节各种类型的热管理应用中的共沸混合冷却剂的特性。
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公开(公告)号：US07602608B2
公开(公告)日：2009-10-13
申请号：US11347898
申请日：2006-02-06
申请人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.
摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在密封密封的壳体内并且通过将多个喷嘴中的雾化液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。
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8.发明授权Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules 有权混合信号三维封装冷却，混合功率密度电子模块公开(公告)号：US07301772B2
公开(公告)日：2007-11-27
申请号：US11351660
申请日：2006-02-09
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.
摘要翻译： 一种用于冷却具有不同功率密度和干扰信号的电子元件系统的集成三维包装和冷却系统。
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公开(公告)号：US06889515B2
公开(公告)日：2005-05-10
申请号：US10368289
申请日：2003-02-14
IPC分类号： F28F7/02 , H01L23/433 , F25D23/12
CPC分类号： F28D15/0266 , F28D5/00 , F28D15/0258 , F28F7/02 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
摘要翻译： 一种用于有效地管理单个或多个半导体芯片封装的喷雾冷却系统。 喷雾冷却系统包括具有泵单元和储存器的热交换器单元，流体连接到热交换器单元的同轴管，连接到同轴管的耦合器单元和喷射模块，其中耦合器单元可拆卸地连接到 喷雾模块。 热交换器单元具有允许进入和释放空气而不干扰其运行的耐空气设计。
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公开(公告)号：US5880931A
公开(公告)日：1999-03-09
申请号：US44841
申请日：1998-03-20
IPC分类号： H05K7/20
CPC分类号： H05K7/20672 , H05K7/20345 , Y10S165/908
摘要： A spray cooled circuit card cage includes opposed card guides separated by opposed card cage side panels. Each card guide carries a top rail and lower manifold. The manifold provides coolant fluid to a plurality of spray plate assemblies, which direct a spray of coolant over the top surface of the electronic cards carried between the card guides. A VME or other type of electronic back plane is typically attached to the manifolds and a back plane support, and is in electronic communication with the circuit cards.
摘要翻译： 喷雾冷却电路卡笼包括由相对的卡笼侧板隔开的相对的卡导向件。 每个卡片导轨都带有一个顶部导轨和下部歧管。 歧管将冷却剂流体提供给多个喷射板组件，其将冷却剂喷射引导到在卡引导件之间承载的电子卡片的顶表面上。 VME或其他类型的电子背板通常附接到歧管和背板支撑件，并且与电路卡电子通信。
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