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公开(公告)号：US20080217637A1
公开(公告)日：2008-09-11
申请号：US11994813
申请日：2005-11-09
Applicant: Do Hyung Kim , Chung-Hoon Lee
Inventor： Do Hyung Kim , Chung-Hoon Lee
CPC classification number: H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005
Abstract: The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.
Abstract translation: 发光二极管及其制造方法技术领域本发明涉及一种发光二极管及其制造方法，其中均匀地维持荧光物质与发光二极管芯片之间的距离，以提高发光效率。 为此，提供了一种发光二极管，其包括至少一个发光二极管芯片，用于向发光二极管芯片施加电力的引线端子，以及用于将发光二极管芯片安装在其上的框架， 形成为具有与发光二极管芯片相对应的预定高度和形状。
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公开(公告)号：US20080191232A1
公开(公告)日：2008-08-14
申请号：US11997459
申请日：2006-07-26
Applicant: Chung Hoon Lee , Do Hyung Kim
Inventor： Chung Hoon Lee , Do Hyung Kim
IPC: H01L33/00
CPC classification number: H01L33/58 , H01L33/54 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
Abstract: Disclosed herein is a light emitting device with a silicone lens. The light emitting device comprises a heat sink. A package body surrounds at least a portion of the heat sink, and a light emitting diode is mounted on the heat sink. Meanwhile, the light emitting diode is covered with a silicone lens molded on the package body. The molded silicone lens can be employed to prevent reduction in light extraction efficiency due to poor bonding between lens and encapsulant.
Abstract translation: 本文公开了具有硅氧烷透镜的发光装置。 发光装置包括散热器。 封装体围绕散热器的至少一部分，并且发光二极管安装在散热器上。 同时，发光二极管被模制在封装体上的硅胶透镜覆盖。 可以使用模制的硅胶透镜，以防止由于透镜和密封剂之间的接合不良导致的光提取效率降低。
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公开(公告)号：US08283693B2
公开(公告)日：2012-10-09
申请号：US11997459
申请日：2006-07-26
Applicant: Chung Hoon Lee , Do Hyung Kim
Inventor： Chung Hoon Lee , Do Hyung Kim
CPC classification number: H01L33/58 , H01L33/54 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
Abstract: Disclosed herein is a light emitting device with a silicone lens. The light emitting device comprises a heat sink. A package body surrounds at least a portion of the heat sink, and a light emitting diode is mounted on the heat sink. Meanwhile, the light emitting diode is covered with a silicone lens molded on the package body. The molded silicone lens can be employed to prevent reduction in light extraction efficiency due to poor bonding between lens and encapsulant.
Abstract translation: 本文公开了具有硅氧烷透镜的发光装置。 发光装置包括散热器。 封装体围绕散热器的至少一部分，并且发光二极管安装在散热器上。 同时，发光二极管被模制在封装体上的硅胶透镜覆盖。 可以使用模制的硅胶透镜，以防止由于透镜和密封剂之间的接合不良导致的光提取效率降低。
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4.发明授权Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die 有权具有散热器支撑环并具有多个模制树脂的发光二极管封装，其中具有比初始模塑树脂更高的硬度的二次模塑树脂并且覆盖覆盖LED模具的初级模塑树脂公开(公告)号：US07737463B2
公开(公告)日：2010-06-15
申请号：US12196028
申请日：2008-08-21
Applicant: Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
Inventor： Chung Hoon Lee , Do Hyung Kim , Keon Young Lee
CPC classification number: H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
Abstract: Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals and a heat sink inserted into a heat sink support ring. At least portions of the pair of lead terminals and the heat sink are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
Abstract translation: 公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子和插入散热器支撑环的散热器。 一对引线端子和散热片的至少一部分嵌入在封装主体中。 包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。 第一模塑树脂覆盖LED芯片。 具有比第一成型体硬度高的第二成型树脂覆盖第一成型树脂。 因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。
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公开(公告)号：US08809892B2
公开(公告)日：2014-08-19
申请号：US13115084
申请日：2011-05-24
Applicant: Do Hyung Kim , Chung-Hoon Lee
Inventor： Do Hyung Kim , Chung-Hoon Lee
CPC classification number: H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005
Abstract: The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.
Abstract translation: 发光二极管及其制造方法技术领域本发明涉及一种发光二极管及其制造方法，其中均匀地维持荧光物质与发光二极管芯片之间的距离，以提高发光效率。 为此，提供了一种发光二极管，其包括至少一个发光二极管芯片，用于向发光二极管芯片施加电力的引线端子，以及用于将发光二极管芯片安装在其上的框架， 形成为具有与发光二极管芯片相对应的预定高度和形状。
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Patent Agency Ranking
公开(公告)号：US20100202131A1
公开(公告)日：2010-08-12
申请号：US12680097
申请日：2008-09-19
Applicant: Tae Kwang Kim , Chung Hoon Lee , Do Hyung Kim , Seung Ryeol Ryu , Chan Sung Jeong , Woong Joon Hwang
Inventor： Tae Kwang Kim , Chung Hoon Lee , Do Hyung Kim , Seung Ryeol Ryu , Chan Sung Jeong , Woong Joon Hwang
IPC: G02F1/13357 , H01L33/58
CPC classification number: H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
Abstract translation: 公开了一种发光二极管（LED）封装。 LED封装包括具有空腔的封装主体和位于空腔顶部的台阶部分; 安装在所述腔的底表面上的LED芯片; 形成在空腔中以覆盖LED芯片的密封剂; 以及具有图案并附着在密封剂上的阶梯部分的透镜。
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公开(公告)号：US08058662B2
公开(公告)日：2011-11-15
申请号：US11994813
申请日：2005-11-09
Applicant: Do Hyung Kim , Chung-Hoon Lee
Inventor： Do Hyung Kim , Chung-Hoon Lee
CPC classification number: H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005
Abstract: The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.
Abstract translation: 发光二极管及其制造方法技术领域本发明涉及一种发光二极管及其制造方法，其中均匀地维持荧光物质与发光二极管芯片之间的距离，以提高发光效率。 为此，提供了一种发光二极管，其包括至少一个发光二极管芯片，用于向发光二极管芯片施加电力的引线端子，以及用于将发光二极管芯片安装在其上的框架， 形成为具有与发光二极管芯片相对应的预定高度和形状。
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公开(公告)号：US08360593B2
公开(公告)日：2013-01-29
申请号：US12680097
申请日：2008-09-19
Applicant: Tae Kwang Kim , Chung Hoon Lee , Do Hyung Kim , Seung Ryeol Ryu , Chan Sung Jeong , Woong Joon Hwang
Inventor： Tae Kwang Kim , Chung Hoon Lee , Do Hyung Kim , Seung Ryeol Ryu , Chan Sung Jeong , Woong Joon Hwang
IPC: H01L33/00
CPC classification number: H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
Abstract translation: 公开了一种发光二极管（LED）封装。 LED封装包括具有空腔的封装主体和位于空腔顶部的台阶部分; 安装在所述腔的底表面上的LED芯片; 形成在空腔中以覆盖LED芯片的密封剂; 以及具有图案并附着在密封剂上的阶梯部分的透镜。
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公开(公告)号：US07361940B2
公开(公告)日：2008-04-22
申请号：US11178144
申请日：2005-07-08
Applicant: Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
Inventor： Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L23/4334 , H01L24/48 , H01L25/0753 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
Abstract: A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
Abstract translation: 被配置为与诸如发光二极管（LED）的电子设备一起使用的引线框架包括用于支撑散热器的散热器支撑环。 外框架与散热器支撑环间隔开，并且包围散热器支撑环。 至少一个支撑引线连接散热器支撑环和外框。 分离的引线从外框架朝向散热器支撑环延伸，并且与散热器支撑环间隔开。 可以在散热器之后通过注射成型形成的封装体插入引线框架中。
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公开(公告)号：US09280703B2
公开(公告)日：2016-03-08
申请号：US13596523
申请日：2012-08-28
Applicant: Woo Han Yun , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
Inventor： Woo Han Yun , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
IPC: G06K9/00
CPC classification number: G06K9/00355
Abstract: Disclosed are an apparatus for tracking a location of a hand, includes: a skin color image detector for detecting a skin color region from an image input from an image device using a predetermined skin color of a user; a face tracker for tracking a face using the detected skin color image; a motion detector for setting a ROI using location information of the tracked face, and detecting a motion image from the set ROI; a candidate region extractor for extracting a candidate region with respect to a hand of the user using the skin color image detected by the skin color image detector and the motion image detected by the motion detector; and a hand tracker for tracking a location of the hand in the extracted candidate region to find out a final location of the hand.
Abstract translation: 公开了一种用于跟踪手的位置的装置，包括：皮肤彩色图像检测器，用于使用用户的预定皮肤颜色从图像设备输入的图像中检测皮肤颜色区域; 面部跟踪器，用于使用检测到的肤色图像跟踪脸部; 运动检测器，用于使用所跟踪的面部的位置信息来设置ROI，以及从所设置的ROI检测运动图像; 候选区域提取器，用于使用由肤色图像检测器检测到的肤色图像和由运动检测器检测的运动图像提取相对于用户的手的候选区域; 以及用于跟踪所提取的候选区域中的手的位置以找出手的最终位置的手跟踪器。
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