-
公开(公告)号：US11119012B2
公开(公告)日：2021-09-14
申请号：US15962426
申请日：2018-04-25
申请人： Dimitry Boguslavsky , Mark Kovler
发明人： Dimitry Boguslavsky , Mark Kovler
摘要： An apparatus and method for cleaving a liquid sample are disclosed. The apparatus includes a load lock chamber containing a cleaving module, a cryo-cooler, a vacuum chamber configured to receive the cleaving module from the load lock chamber, and a gate valve between the load lock chamber and the vacuum chamber. The cleaving module is configured to cleave a crystalline sample holder and the liquid sample. The liquid sample includes one or more liquid phase materials and is cleavable by the cleaving module when in the solid phase. The cryo-cooler is configured to cool and/or maintain a temperature of the sample holder and the sample below the melting point of each of the liquid phase materials. The gate valve has at least one opening therein configured to (i) allow the cleaving module to enter and exit the vacuum chamber and/or (ii) permit gaseous communication between the load lock chamber and the vacuum chamber.
-
公开(公告)号：US10213940B2
公开(公告)日：2019-02-26
申请号：US14871668
申请日：2015-09-30
申请人： Dimitry Boguslavsky , Mark Kovler
发明人： Dimitry Boguslavsky , Mark Kovler
摘要： A device for cleaving a crystalline sample, the device comprises: upper and lower bending elements that are arranged to contact upper and lower surfaces of the crystalline sample and to apply a bending moment on the crystalline sample; a first surface impact element that contacts a first surface of the crystalline sample; a cleaving element that is arranged to impact a second surface of the crystalline sample while the bending moment is applied on the crystalline element; wherein the second surface is opposite to the first side and oriented to the upper and lower surfaces of the crystalline sample wherein the device excludes any second surface alignment element for aligning the crystalline sample by contacting the second surface.
-
公开(公告)号：US09911573B2
公开(公告)日：2018-03-06
申请号：US14642138
申请日：2015-03-09
申请人： Dimitry Boguslavsky , Mark Kovler
发明人： Dimitry Boguslavsky , Mark Kovler
IPC分类号： C23C16/50 , H01J37/305 , G01N1/32 , H01J37/147 , H01J37/20
CPC分类号： H01J37/3056 , G01N1/32 , H01J37/147 , H01J37/20 , H01J2237/0245 , H01J2237/0827 , H01J2237/1505 , H01J2237/31745 , H01J2237/31749
摘要： Methods, apparatuses, systems and software for ion beam milling or machining are disclosed. The apparatus includes a specimen holder, a table, one or more ion sources, rotatable ion optics, and an imaging device. The specimen holder is configured to hold a specimen in a stationary position during milling or machining. The table is configured to change the stationary position of the specimen holder in any of three orthogonal linear directions and an angular direction. The rotatable ion optics are configured to emit an ion beam towards a predetermined location on the specimen from any of the one or more ion sources at any angle around an axis that is orthogonal to a horizontal surface of the table when the angular direction of the table is 0°. The imaging device is configured to generate an image of the specimen including the predetermined location, thereby enabling real-time monitoring of the milling or machining process.
-
公开(公告)号：US08721907B2
公开(公告)日：2014-05-13
申请号：US13282492
申请日：2011-10-27
申请人： Dimitry Boguslavsky , Colin Smith
发明人： Dimitry Boguslavsky , Colin Smith
IPC分类号： C23F1/00
CPC分类号： G01N1/286 , G01N2001/2873 , H01J37/3023 , H01J2237/31745
摘要： A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.
摘要翻译： 用于铣削和检查物体的系统和方法。 该方法可以包括执行序列的至少一次迭代，其包括：在第一表面研磨周期期间，通过粒子束研磨物体的第一表面; 在所述第一表面研磨周期的至少大部分期间，通过电子检测器获得所述物体的第二表面的图像; 其中所述物体预期包括位于所述第一和第二表面之间的感兴趣元件（EOI）; 在第二表面研磨周期期间通过所述粒子束研磨所述物体的第二表面; 其中所述第一表面研磨周期和所述第二表面研磨周期中的每一个具有超过长持续时间阈值的持续时间; 在第二表面研磨周期的至少大部分期间，由电子检测器获得物体的第一表面的图像。
-
公开(公告)号：US20120103938A1
公开(公告)日：2012-05-03
申请号：US13282492
申请日：2011-10-27
申请人： Dimitry Boguslavsky , Colin Smith
发明人： Dimitry Boguslavsky , Colin Smith
IPC分类号： B44C1/22
CPC分类号： G01N1/286 , G01N2001/2873 , H01J37/3023 , H01J2237/31745
摘要： A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.
摘要翻译： 用于铣削和检查物体的系统和方法。 该方法可以包括执行序列的至少一次迭代，其包括：在第一表面研磨周期期间，通过粒子束研磨物体的第一表面; 在所述第一表面研磨周期的至少大部分期间，通过电子检测器获得所述物体的第二表面的图像; 其中所述物体预期包括位于所述第一和第二表面之间的感兴趣元件（EOI）; 在第二表面研磨周期期间通过所述粒子束研磨所述物体的第二表面; 其中所述第一表面研磨周期和所述第二表面研磨周期中的每一个具有超过长持续时间阈值的持续时间; 在第二表面研磨周期的至少大部分期间，由电子检测器获得物体的第一表面的图像。
-
-
-
-
搜索结果
5 条记录 (耗时 0.013 秒)
