公开(公告)号：US11833608B2

公开(公告)日：2023-12-05

申请号：US17653564

申请日：2022-03-04

申请人： DISCO CORPORATION

发明人： Naotoshi Kirihara ,  Takamasa Kaneko

IPC分类号： B23K26/0622 ,  B23K26/40 ,  B23K26/352 ,  B23K26/364 ,  B23K101/40

CPC分类号： B23K26/0622 ,  B23K26/352 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40

摘要： There is provided a laser processing method for performing laser processing on a wafer having a functional layer on a substrate. The laser processing method includes a blackening step of emitting a pulsed laser beam of a wavelength transparent to the functional layer from a laser oscillator and blackening the functional layer by irradiating the functional layer with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the functional layer is processed such that an overlap ratio of the pulsed laser beam successively applied to the functional layer is equal to or more than 90% and less than 100%, and a groove processing step of forming a laser-processed groove by irradiating the blackened functional layer with the pulsed laser beam and making the blackened functional layer absorb the pulsed laser beam, after performing the blackening step.