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公开(公告)号:US20240069155A1
公开(公告)日:2024-02-29
申请号:US18494685
申请日:2023-10-25
Applicant: DENSO CORPORATION
Inventor: Yusuke TAINAKA , Ryuji AOKI , Akihumi KURITA
CPC classification number: G01S7/03 , G01S7/023 , G01S13/931 , H01Q1/3233 , H01Q1/42 , H01Q21/065 , G01S2013/93275
Abstract: A radar apparatus includes an antenna unit, a cover portion, and a radio-wave suppression portion. The antenna unit includes an antenna surface in which one or more antennas that radiate radio waves are provided and is configured to emit a target radio wave of a predetermined frequency band. The cover portion is configured to be provided in a position through which the target radio wave passes. The radio-wave suppression portion is integrated with the cover portion in an out-of-detection-range area, of an outer surface of the cover portion, that is an area outside a range of a detection angle of the antenna portion, and includes a conductive portion that has conductivity and a non-conductive portion that does not have conductivity.
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公开(公告)号:US20230243920A1
公开(公告)日:2023-08-03
申请号:US18299992
申请日:2023-04-13
Applicant: DENSO CORPORATION
Inventor: Kazuhiro AOKI , Yusuke TAINAKA
Abstract: An antenna apparatus includes a conductor layer A, a conductor layer B, and a dielectric layer that is sandwiched between the conductor layer A and the conductor layer B. In the conductor layer A, a first antenna, a second antenna, and a connection conductor are formed. The connection conductor is connected to both of the first antenna and the second antenna. In the dielectric layer, a guard conductor is provided. The guard conductor is arranged along an outer periphery of the connection conductor that excludes at least a first connection section and a second connection section of the connection conductor. The first connection section is a connection section of the connection conductor that is connected to the first antenna. The second connection section is a connection section of the connection conductor that is connected to the second antenna.
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公开(公告)号:US20220285308A1
公开(公告)日:2022-09-08
申请号:US17826418
申请日:2022-05-27
Applicant: DENSO CORPORATION
Inventor: Shuji HIRATA , Akira SHINTAI , Atsushi MUNAOKA , Masahiro MATSUNOSHITA , Yusuke TAINAKA
IPC: H01L23/00 , H01L23/498 , H01L23/31 , G01S7/03 , G01S13/931
Abstract: A radar device includes: a substrate including multiple high-frequency conductor layers arranged on a front surface; a semiconductor component in contact with the high-frequency conductor layers via conductive members; and an adhesive that bonds the semiconductor component to the front surface of the substrate. The semiconductor component has a bottom surface and a first side surface facing in a first direction. All the multiple high-frequency conductor layers include at least high-frequency conductor layers bending in a plane of the front surface and thereby extend, on the front surface, from inside ends facing the bottom surface to outside ends positioned in the first direction from the first side surface. The adhesive is in contact with the front surface except for the sites of the multiple high-frequency conductor layers formed and in contact with the side surfaces of the semiconductor component.
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公开(公告)号:US20210336320A1
公开(公告)日:2021-10-28
申请号:US17370777
申请日:2021-07-08
Applicant: DENSO CORPORATION
Inventor: Yuuji KAKUYA , Kazuhiro AOKI , Yusuke TAINAKA
Abstract: A transmission line assembly is configured such that (i) a first target inner layer is one of second to (N−1)-th pattern layers selected therefrom, and (ii) a second target inner layer is another one of the second to (N−1)-th pattern layers selected therefrom; the second to (N−1)-th pattern layers except for the first and second target inner layers are referred to as inner layers. The transmission line assembly includes band-like first and second slits formed through the ground pattern of a corresponding one of the first and second target inner layers to expose a part of one of dielectric layers; the one of the dielectric layers is adjacent to the corresponding one of the first and second target inner layers. Each of the first and second slits has an edge facing the interlayer line, and the edge of each of the first and second slits is concavely curved toward the interlayer line.
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公开(公告)号:US20220128650A1
公开(公告)日:2022-04-28
申请号:US17646786
申请日:2022-01-03
Applicant: DENSO CORPORATION
Inventor: Yusuke TAINAKA , Akira SHINTAI , Shinji KAWANO
Abstract: In a radar apparatus, a high-frequency integrated circuit is mounted to a board, and a shielding case encloses the high-frequency integrated circuit. A radio-absorbing and heat-dissipative gel is arranged to cover at least part of the high-frequency integrated circuit and to be in contact with the shielding case.
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公开(公告)号:US20220416394A1
公开(公告)日:2022-12-29
申请号:US17929241
申请日:2022-09-01
Applicant: DENSO CORPORATION
Inventor: Yusuke TAINAKA , Kazuhiro AOKI , Kenji GOTO
Abstract: A double-sided board includes a first-type conductor layer, a second-type conductor layer, a waveguide-filled dielectric layer and a waveguide. The waveguide-filled dielectric layer is a dielectric layer provided between the first-type conductor layer and the second-type conductor layer. The waveguide is provided in such a manner as to penetrate the waveguide-filled dielectric layer in a direction from one of the first-type conductor layer and the second-type conductor layer to the other of the two conductor layers. A cross section of the waveguide in a plane parallel to the first-type conductor layer has a longitudinal direction and a lateral direction perpendicular to the longitudinal direction. The cross section of the waveguide has, along the longitudinal direction, a central part and two end parts located respectively on two sides of the central part. A lateral length of each of the end parts is larger than a lateral length of the central part.
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公开(公告)号:US20220132711A1
公开(公告)日:2022-04-28
申请号:US17646788
申请日:2022-01-03
Applicant: DENSO CORPORATION
Inventor: Yusuke TAINAKA , Akira SHINTAI , Shinji KAWANO
IPC: H05K9/00 , H05K7/20 , G01S13/931 , G01S7/02
Abstract: A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.
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