公开(公告)号：US20220285308A1

公开(公告)日：2022-09-08

申请号：US17826418

申请日：2022-05-27

Applicant: DENSO CORPORATION

Inventor： Shuji HIRATA ,  Akira SHINTAI ,  Atsushi MUNAOKA ,  Masahiro MATSUNOSHITA ,  Yusuke TAINAKA

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  G01S7/03 ,  G01S13/931

Abstract: A radar device includes: a substrate including multiple high-frequency conductor layers arranged on a front surface; a semiconductor component in contact with the high-frequency conductor layers via conductive members; and an adhesive that bonds the semiconductor component to the front surface of the substrate. The semiconductor component has a bottom surface and a first side surface facing in a first direction. All the multiple high-frequency conductor layers include at least high-frequency conductor layers bending in a plane of the front surface and thereby extend, on the front surface, from inside ends facing the bottom surface to outside ends positioned in the first direction from the first side surface. The adhesive is in contact with the front surface except for the sites of the multiple high-frequency conductor layers formed and in contact with the side surfaces of the semiconductor component.