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公开(公告)号：US20230291110A1
公开(公告)日：2023-09-14
申请号：US18175701
申请日：2023-02-28
Applicant: DENSO CORPORATION
Inventor： Satoru WAKIYAMA , Akira SHINTAI , Toshifumi SHIROSAKI , Shuji HIRATA
Abstract: A production method of a communication device includes a step of forming an antenna substrate and a circuit substrate independently from each other. The production method also includes a step of joining the antenna substrate and the circuit substrate simultaneously with joining of a power feeding pad and a power feeding path. In brief, the production method executes two discrete steps: forming the circuit substrate and forming the antenna substrate. This improves a production yield of the communication device as compared with the circuit substrate and the antenna substrate are produced in a single step.
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公开(公告)号：US20220285308A1
公开(公告)日：2022-09-08
申请号：US17826418
申请日：2022-05-27
Applicant: DENSO CORPORATION
Inventor： Shuji HIRATA , Akira SHINTAI , Atsushi MUNAOKA , Masahiro MATSUNOSHITA , Yusuke TAINAKA
IPC: H01L23/00 , H01L23/498 , H01L23/31 , G01S7/03 , G01S13/931
Abstract: A radar device includes: a substrate including multiple high-frequency conductor layers arranged on a front surface; a semiconductor component in contact with the high-frequency conductor layers via conductive members; and an adhesive that bonds the semiconductor component to the front surface of the substrate. The semiconductor component has a bottom surface and a first side surface facing in a first direction. All the multiple high-frequency conductor layers include at least high-frequency conductor layers bending in a plane of the front surface and thereby extend, on the front surface, from inside ends facing the bottom surface to outside ends positioned in the first direction from the first side surface. The adhesive is in contact with the front surface except for the sites of the multiple high-frequency conductor layers formed and in contact with the side surfaces of the semiconductor component.
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