公开(公告)号：US20240170432A1

公开(公告)日：2024-05-23

申请号：US18472309

申请日：2023-09-22

Applicant: DENSO CORPORATION

Inventor： Yoichi SASAKI ,  Satoru WAKIYAMA

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L24/20 ,  H01L23/3157 ,  H01L24/19 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/215 ,  H01L2924/35121

Abstract: A semiconductor device includes: a die; a mold material layer in which the die is embedded in a state where an electrode surface of the die is exposed from a surface of the mold material layer; and a redistribution layer provided on a surface of the mold material layer and having an insulating layer and a wiring in a multilayer state, as a fan out wafer level package. The semiconductor device further has a reinforcing structure made of a material harder than the insulating layer, on the insulating layer of the redistribution layer. The reinforcing structure is located between the wiring and a surface of the mold material layer. The reinforcing structure is at a position corresponding to a boundary region between the die and the mold material layer.

公开(公告)号：US20240170367A1

公开(公告)日：2024-05-23

申请号：US18472350

申请日：2023-09-22

Applicant: DENSO CORPORATION

Inventor： Yoichi SASAKI ,  Satoru WAKIYAMA

IPC: H01L23/433 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/4334 ,  H01L21/568 ,  H01L23/145 ,  H01L23/3107 ,  H01L23/5386 ,  H01L23/5389

Abstract: A semiconductor device includes: a die; a mold material layer in which the die is embedded in a state where an electrode surface of the die is exposed from the mold material layer; and a redistribution layer provided on a surface of the mold material layer and having an insulating layer and a wiring in a multilayer state, as a fan out wafer level package. The wiring of the redistribution layer has a reinforcing portion that is thicker in a thickness direction within an area corresponding to a boundary region between the die and the mold material layer than the other area.

公开(公告)号：US20230291110A1

公开(公告)日：2023-09-14

申请号：US18175701

申请日：2023-02-28

Applicant: DENSO CORPORATION

Inventor： Satoru WAKIYAMA ,  Akira SHINTAI ,  Toshifumi SHIROSAKI ,  Shuji HIRATA

IPC: H01Q9/04 ,  H01Q1/52 ,  H01Q1/48

CPC classification number: H01Q9/045 ,  H01Q1/526 ,  H01Q1/48

Abstract: A production method of a communication device includes a step of forming an antenna substrate and a circuit substrate independently from each other. The production method also includes a step of joining the antenna substrate and the circuit substrate simultaneously with joining of a power feeding pad and a power feeding path. In brief, the production method executes two discrete steps: forming the circuit substrate and forming the antenna substrate. This improves a production yield of the communication device as compared with the circuit substrate and the antenna substrate are produced in a single step.

公开(公告)号：US20210399034A1

公开(公告)日：2021-12-23

申请号：US17348884

申请日：2021-06-16

Applicant: DENSO CORPORATION

Inventor： Kouji SATOU ,  Hiroki SASAKI ,  Shotaro MIYAWAKI ,  Akira WADA ,  Satoru WAKIYAMA ,  Kazuhiro AOYAMA

IPC: H01L27/146 ,  H01L23/00

Abstract: A camera module is configured to capture an optical image of a target area and includes a lens member, an imager, a light transmitting member, and a seat. The lens member is configured to receive light from the target area. The imager has a curved portion convex in a direction away from the lens member and is configured to capture the optical image formed on the curved portion. The light transmitting member optically couples the lens member and the imager. The seat has a supporting portion that supports an outer rim of the imager and a fluid space defined inside the supporting portion. A heat dissipation fluid undergoes convection in the fluid space. The curved portion is interposed between the light transmitting member and the seat having the supporting portion and the fluid space.