公开(公告)号：US10755190B2

公开(公告)日：2020-08-25

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E. G. Sterling ,  Gregory Citver

IPC: H01F7/06 ,  G06N10/00 ,  H03H3/00 ,  H01F41/04 ,  H01F13/00 ,  H03H7/42 ,  H05K1/02 ,  H01F41/076 ,  H03H1/00 ,  H05K1/16 ,  H01L39/14 ,  H01L39/02

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

公开(公告)号：US20200092985A1

公开(公告)日：2020-03-19

申请号：US16562984

申请日：2019-09-06

Applicant: D-WAVE SYSTEMS INC.

Inventor： David S. Bruce ,  Pedro A. de Buen

IPC: H05K1/02 ,  H05K3/46

Abstract: A multilayer filter printed circuit board includes filtering material in one or more filter layers. The filtering material can include superconducting material, normal material, magnetic material and semi-conductor material. The multilayer filter printed circuit board may be used as part of a tubular filter structure. The filtering material may be dispersed in, or on the filter layers in a pattern or at random. The filter layers may have a first and second portion that are co-planar, and comprising different filtering materials from one another. The first and second portion may be electrically isolated from one another. Two or more filter layers may comprise different filtering materials from one another. Additional filter layers comprising filtering material may be formed outward of the outer electrically insulative layers.

公开(公告)号：US20170178018A1

公开(公告)日：2017-06-22

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E.G. Sterling ,  Gregory Citver

IPC: G06N99/00 ,  H01L39/12 ,  H01L39/24 ,  H05K3/34 ,  H05K9/00 ,  F25B43/00 ,  H01L39/18 ,  H01F41/06 ,  H01F41/04 ,  H01F13/00 ,  F25B9/12 ,  H03H3/00 ,  H05K1/02

CPC classification number: G06N10/00 ,  H01F13/006 ,  H01F41/048 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H03H3/00 ,  H03H7/425 ,  H03H2001/005 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/16 ,  H05K2201/10287

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.