公开(公告)号：US11118908B2

公开(公告)日：2021-09-14

申请号：US15323845

申请日：2015-06-25

申请人： Continental Teves AG & Co. oHG

发明人： Thomas Fischer ,  Jakob Schillinger ,  Dietmar Huber ,  Stefan Günthner ,  Lothar Biebricher ,  Michael Schulmeister

IPC分类号： G01P15/00 ,  B81B7/00 ,  G01C19/5733 ,  G01D11/30 ,  G01D11/10 ,  B60W10/06 ,  B60W10/184 ,  B60W30/02 ,  G01C19/5769 ,  G01P1/00 ,  G01P15/08

摘要： A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

公开(公告)号：US10718640B2

公开(公告)日：2020-07-21

申请号：US16092048

申请日：2017-03-27

申请人： Continental Teves AG & Co. oHG

发明人： Lothar Biebricher ,  Marco Benner ,  Jakob Schillinger ,  Dietmar Huber ,  Thomas Fischer ,  Stefan Günthner ,  Michael Schulmeister

IPC分类号： H05K5/00 ,  G01D11/24 ,  B29C45/14 ,  B29C45/16 ,  B29K101/12 ,  B29L31/34

摘要： A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

公开(公告)号：US20190113370A1

公开(公告)日：2019-04-18

申请号：US16092048

申请日：2017-03-27

申请人： Continental Teves AG & Co. oHG

发明人： Lothar Biebricher ,  Marco Benner ,  Jakob Schillinger ,  Dietmar Huber ,  Thomas Fischer ,  Stefan Günthner ,  Michael Schulmeister

IPC分类号： G01D11/24

CPC分类号： G01D11/245 ,  B29C45/14073 ,  B29C45/1671 ,  B29K2101/12 ,  B29L2031/3481

摘要： A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

公开(公告)号：US10953578B2

公开(公告)日：2021-03-23

申请号：US15038595

申请日：2014-11-27

申请人： Continental Teves AG & Co. oHG

发明人： Thomas Fischer ,  Lothar Biebricher ,  Jakob Schillinger ,  Dietmar Huber ,  Michael Schulmeister ,  Stefan Günthner

IPC分类号： B29C45/14 ,  B29C45/16 ,  B29L31/34 ,  G01D11/24

摘要： A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

公开(公告)号：US09961779B2

公开(公告)日：2018-05-01

申请号：US14652507

申请日：2013-12-10

申请人： Continental Teves AG & Co. oHG

发明人： Lothar Biebricher ,  Michael Schulmeister ,  Jakob Schillinger ,  Dietmar Huber ,  Thomas Fischer ,  Stefan Günthner ,  Waldemar Baumung

IPC分类号： H05K1/18 ,  H05K3/30 ,  H01L23/31 ,  H01L23/00 ,  H01L23/552 ,  H01L23/495

CPC分类号： H05K3/30 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/495 ,  H01L23/552 ,  H01L23/562 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/186 ,  Y10T29/49147 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.

公开(公告)号：US20170146345A1

公开(公告)日：2017-05-25

申请号：US15323845

申请日：2015-06-25

申请人： Continental Teves AG & Co. oHG

发明人： Thomas Fischer ,  Jakob Schillinger ,  Dietmar Huber ,  Stefan Günthner ,  Lothar Biebricher ,  Michael Schulmeister

IPC分类号： G01C19/5733 ,  G01P15/08 ,  B60W30/02 ,  B60W10/184 ,  B60W10/06 ,  G01C19/5769 ,  G01P1/00

摘要： A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

公开(公告)号：US20150351252A1

公开(公告)日：2015-12-03

申请号：US14652507

申请日：2013-12-10

申请人： CONTINENTAL TEVES AG & CO. OHG

发明人： Lothar Biebricher ,  Michael Schulmeister ,  Jakob Schillinger ,  Dietmar Huber ,  Thomas Fischer ,  Stefan Günthner ,  Waldemar Baumung

IPC分类号： H05K3/30 ,  H05K1/18

CPC分类号： H05K3/30 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/495 ,  H01L23/552 ,  H01L23/562 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/186 ,  Y10T29/49147 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and -encapsulating the electronic component with the encapsulation material.

摘要翻译： 一种电子组件的制造方法，其中，利用封装材料将支撑在布线支撑体上的电子部件封装在一起，其特征在于，包括：将电子部件以布线支撑体的方式配置，使得通过 封装材料低于预定值; 并用封装材料封装电子部件。