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公开(公告)号：US10953578B2
公开(公告)日：2021-03-23
申请号：US15038595
申请日：2014-11-27
发明人： Thomas Fischer , Lothar Biebricher , Jakob Schillinger , Dietmar Huber , Michael Schulmeister , Stefan Günthner
摘要： A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.
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2.发明授权公开(公告)号：US11169260B2
公开(公告)日：2021-11-09
申请号：US16320540
申请日：2017-06-28
IPC分类号： G01S13/931 , G01S13/74
摘要： A method for determining the position of a mobile radio station by a vehicle, the method being based on a plurality of radio measurements. The invention further relates to a vehicle for carrying out such a method.
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公开(公告)号：US20190139931A1
公开(公告)日：2019-05-09
申请号：US16092516
申请日：2017-06-02
摘要： A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.
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公开(公告)号：US20170146345A1
公开(公告)日：2017-05-25
申请号：US15323845
申请日：2015-06-25
发明人： Thomas Fischer , Jakob Schillinger , Dietmar Huber , Stefan Günthner , Lothar Biebricher , Michael Schulmeister
IPC分类号： G01C19/5733 , G01P15/08 , B60W30/02 , B60W10/184 , B60W10/06 , G01C19/5769 , G01P1/00
摘要： A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.
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公开(公告)号：US20150351252A1
公开(公告)日：2015-12-03
申请号：US14652507
申请日：2013-12-10
发明人： Lothar Biebricher , Michael Schulmeister , Jakob Schillinger , Dietmar Huber , Thomas Fischer , Stefan Günthner , Waldemar Baumung
CPC分类号： H05K3/30 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/495 , H01L23/552 , H01L23/562 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/16145 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H05K1/186 , Y10T29/49147 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and -encapsulating the electronic component with the encapsulation material.
摘要翻译： 一种电子组件的制造方法，其中，利用封装材料将支撑在布线支撑体上的电子部件封装在一起，其特征在于，包括：将电子部件以布线支撑体的方式配置，使得通过 封装材料低于预定值; 并用封装材料封装电子部件。
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6.发明授权公开(公告)号：US10950574B2
公开(公告)日：2021-03-16
申请号：US16092516
申请日：2017-06-02
摘要： A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.
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公开(公告)号：US09961779B2
公开(公告)日：2018-05-01
申请号：US14652507
申请日：2013-12-10
发明人： Lothar Biebricher , Michael Schulmeister , Jakob Schillinger , Dietmar Huber , Thomas Fischer , Stefan Günthner , Waldemar Baumung
IPC分类号： H05K1/18 , H05K3/30 , H01L23/31 , H01L23/00 , H01L23/552 , H01L23/495
CPC分类号： H05K3/30 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/495 , H01L23/552 , H01L23/562 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/16145 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H05K1/186 , Y10T29/49147 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.
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公开(公告)号：US20170370750A1
公开(公告)日：2017-12-28
申请号：US15542825
申请日：2016-01-26
CPC分类号： G01D11/245 , B81B2201/02 , G01P1/026 , H01R13/6658 , H01R13/6683 , H01R43/16 , H01R43/24
摘要： A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including—a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface,—wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.
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公开(公告)号：US11118908B2
公开(公告)日：2021-09-14
申请号：US15323845
申请日：2015-06-25
发明人： Thomas Fischer , Jakob Schillinger , Dietmar Huber , Stefan Günthner , Lothar Biebricher , Michael Schulmeister
IPC分类号： G01P15/00 , B81B7/00 , G01C19/5733 , G01D11/30 , G01D11/10 , B60W10/06 , B60W10/184 , B60W30/02 , G01C19/5769 , G01P1/00 , G01P15/08
摘要： A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.
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公开(公告)号：US11035696B2
公开(公告)日：2021-06-15
申请号：US15738349
申请日：2016-06-15
发明人： Martin Haverkamp , Manfred Goll , Heinrich Acker , Henrik Antoni , Jens Habig , Michael Schulmeister , Philipp Schröder
摘要： A sensor arrangement having: a housing, a movement sensor, the movement sensor, being mounted on a bearing element connected to the housing; a position sensor; and a position transducer, the position sensor and the position transducer being arranged relative to each other in such a way that the movement of the movement sensor can be measured. The bearing element protrudes from the housing, or the position sensor and the position transducer are eccentric relative to the bearing element.
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