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8 条记录 (耗时 0.024 秒)

    Multimodal haptic device
    1.
    发明授权
    Multimodal haptic device 有权

    公开(公告)号：US11693481B2

    公开(公告)日：2023-07-04

    申请号：US17538883

    申请日：2021-11-30

    申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

    发明人： Emmanuel Ollier ,  Tristan Caroff ,  Fabrice Casset

    IPC分类号： G06F3/01 ,  G06F3/02

    CPC分类号： G06F3/016 ,  G06F3/0202

    摘要： A multimodal haptic device includes a matrix incorporating at least one cell, each cell comprising: at least one thermal element capable of generating a cooling and a heating; at least one vibratory element capable of generating a vibration; and at least one encapsulation layer made of an electrically insulating material; the at least one vibratory element and the at least one thermal element being anchored in at least one part in the at least one encapsulation layer; each cell being adapted to be in contact directly or indirectly with the skin of a person so as to transmit thermal and/or vibratory sensations to that person, the cell having a thickness less than or equal to ten millimetres.

    Combustion system having improved temperature resistance
    5.
    发明授权
    Combustion system having improved temperature resistance 有权

    公开(公告)号：US10103309B2

    公开(公告)日：2018-10-16

    申请号：US15000744

    申请日：2016-01-19

    申请人： Commissariat a L'Energie Atomique et aux Energies Alternatives

    发明人： Emmanuel Ollier ,  Ioannis Mantzaras

    IPC分类号： H01L35/30 ,  F24S20/20 ,  F24S20/40 ,  F23M5/00 ,  F23B10/00 ,  F23C3/00

    摘要： A combustion system is provided, including at least one combustion module and at least one source of combustible gas and oxidizing gas, the combustion module including a body including a single solid piece of material including two combustion chambers configured to be supplied with the at least one combustible gas and said one oxidizing gas; a first connector in contact with a first end of the body and being heat insulating, including first supply conduits configured to supply a combustible gas to the two combustion chambers, and first evacuation conduits configured to evacuate combustion gas from the two combustion chambers; and a second connector in contact with a second end of the body and being heat insulating, including second supply conduits configured to supply a combustible gas and an oxidizing gas to the two combustion chambers, and second evacuation conduits configured to evacuate combustion gas from the two combustion chambers.

    Combustion module having improved operational safety and optimized thermal efficiency
    6.
    发明授权
    Combustion module having improved operational safety and optimized thermal efficiency 有权

    公开(公告)号：US10422522B2

    公开(公告)日：2019-09-24

    申请号：US15000904

    申请日：2016-01-19

    申请人： Commissariat a l'energie atomique et aux energies alternatives

    发明人： Emmanuel Ollier ,  Ioannis Mantzaras

    IPC分类号： F23C3/00 ,  F24S20/40 ,  F24S20/20

    摘要： A combustion module including a body including a combustion chamber, and at least one connector for supplying the combustion chamber with at least one combustible intended to be burned in the combustion chamber, is provided. The supply connector includes at least one inlet orifice intended to be connected to at least one source of combustible through a conduit and at least one outlet orifice intended to be connected to the at least one combustion chamber. The supply connector has a thermal conductivity substantially lower than that of the body such that the supply connector assures that the temperature at the inlet orifice of the supply connector and the conduit is lower than the auto-ignition temperature of the combustible(s).

    Electronic component and fabrication process of this electronic component
    8.
    发明授权
    Electronic component and fabrication process of this electronic component 有权
    该电子部件的电子部件和制造工艺

    公开(公告)号：US08937385B2

    公开(公告)日：2015-01-20

    申请号：US14098712

    申请日：2013-12-06

    申请人： Commissariat a l'Energie Atomique et aux Energies Alternatives

    发明人： Haykel Ben Jamaa ,  Xavier Baillin ,  Emmanuel Ollier ,  Ulrich Soupremanien

    IPC分类号： H01L23/34 ,  H05K7/20 ,  H01L23/427 ,  H05K13/04 ,  H01L23/31

    CPC分类号： H05K7/205 ,  H01L23/3121 ,  H01L23/4275 ,  H01L2924/0002 ,  H05K13/04 ,  H01L2924/00

    摘要： An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg−1K−1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.

    摘要翻译： 一种电子部件，包括在平面中延伸的基板，具有将所述部件连接到电路的电连接并具有上表面; 布置在基板的上表面或内部并且经由基板连​​接到连接件的电子芯片，形成封装并覆盖芯片的上表面或至少部分的厚绝缘层，并且具有平行于平面的外表面 ; 厚层内的空腔，空腔具有平行于该平面的底部和从底部延伸到外表面的一侧，该腔体内部具有不同于形成厚层的材料的吸热材料。 吸热材料在25℃和100kPa下的比热容大于1kJKg-1K-1。 空腔的底部或侧面都被界面层覆盖。