公开(公告)号：US10477322B2

公开(公告)日：2019-11-12

申请号：US15708822

申请日：2017-09-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich Khenkin ,  Tsjerk Hans Hoekstra

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R1/04

Abstract: The application describes a MEMS transducer comprising:a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.

公开(公告)号：US10696545B2

公开(公告)日：2020-06-30

申请号：US16007799

申请日：2018-06-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich Khenkin ,  David Patten

IPC: B81B7/00 ,  H04R19/04

Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.

公开(公告)号：US10735868B2

公开(公告)日：2020-08-04

申请号：US16179237

申请日：2018-11-02

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Rkia Achehboune ,  Dimitris Drogoudis ,  Roberto Brioschi ,  Aleksey Sergeyevich Khenkin ,  David Patten

IPC: H04R19/04 ,  B81B7/02 ,  H04R1/04 ,  H04R19/00

Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.

公开(公告)号：US10511923B2

公开(公告)日：2019-12-17

申请号：US15938665

申请日：2018-03-28

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Jean Pierre Lasseuguette ,  Aleksey Sergeyevich Khenkin ,  Axel Thomsen

IPC: H04R29/00 ,  B81B7/00 ,  B81C99/00 ,  H04R19/04 ,  H04R19/00

Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.

公开(公告)号：US10972848B2

公开(公告)日：2021-04-06

申请号：US16598799

申请日：2019-10-10

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Jean Pierre Lasseuguette ,  Aleksey Sergeyevich Khenkin ,  Axel Thomsen

IPC: H04R29/00 ,  B81B7/00 ,  B81C99/00 ,  H04R19/04 ,  H04R19/00

Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.

公开(公告)号：US10469956B2

公开(公告)日：2019-11-05

申请号：US15852098

申请日：2017-12-22

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich Khenkin ,  David Patten ,  Dimitris Drogoudis

IPC: H04R19/01 ,  H04R19/04 ,  B81B7/00 ,  H01L27/01 ,  H03H7/06 ,  H04R3/00 ,  H04R19/00 ,  H04R3/06

Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.

公开(公告)号：US20180167744A1

公开(公告)日：2018-06-14

申请号：US15832186

申请日：2017-12-05

Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.

Inventor： Marek Sebastian Piechocinski ,  Roberto Brioschi ,  Rkia Achehboune ,  Aleksey Sergeyevich Khenkin

IPC: H04R19/04 ,  B81B7/00 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00

Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.