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公开(公告)号：US10735868B2
公开(公告)日：2020-08-04
申请号：US16179237
申请日：2018-11-02
Inventor： Rkia Achehboune , Dimitris Drogoudis , Roberto Brioschi , Aleksey Sergeyevich Khenkin , David Patten
Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
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公开(公告)号：US11299392B2
公开(公告)日：2022-04-12
申请号：US16869075
申请日：2020-05-07
Inventor： Rkia Achehboune , Roberto Brioschi , Dimitris Drogoudis , David Patten
Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
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公开(公告)号：US10469956B2
公开(公告)日：2019-11-05
申请号：US15852098
申请日：2017-12-22
Inventor： Aleksey Sergeyevich Khenkin , David Patten , Dimitris Drogoudis
Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
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