公开(公告)号：US20130118716A1

公开(公告)日：2013-05-16

申请号：US13723152

申请日：2012-12-20

Applicant: Yung-I CHENG ,  CPUMATE INC. ,  GOLDEN SUN NEWS TECHNIQUES CO., LTD.

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Ken HSU ,  Chih-Hung CHENG

IPC: F28D15/02

CPC classification number: F28D15/02 ,  B21D53/085 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/126 ,  F28F1/32 ,  F28F3/02 ,  F28F7/00 ,  F28F2215/04 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49359 ,  Y10T29/49364 ,  Y10T29/49373 ,  Y10T29/49377 ,  Y10T29/49378 ,  H01L2924/00

Abstract: A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract translation: 具有能够增加散热面积的散热翅片的散热器包括热管和散热翅片。 热管具有吸热部和散热部。 散热片具有下板和上板。 上板弯曲成与下板重叠，从而在它们之间形成散热路径（b）。 下板和上板分别设置有通孔，使得这两个通孔彼此对应。 热管的散热部分依次穿透散热片的通孔。 以这种方式，可以提高相同高度的散热区域，从而提高散热器的散热效率。

公开(公告)号：US20130126130A1

公开(公告)日：2013-05-23

申请号：US13745751

申请日：2013-01-19

Applicant: CPUMATE INC. ,  GOLDEN SUN NEWS TECHNIQUES CO., LTD.

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Ken HSU ,  Chih-Hung CHENG

IPC: F28D15/02

CPC classification number: F28D15/02 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49368 ,  Y10T29/49377 ,  Y10T29/49378 ,  Y10T29/4938 ,  H01L2924/00

Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Abstract translation: 本发明涉及一种大面积散热器，其中散热体还在其有限的空间内设置。 制造翅片的方法包括以下步骤：提供翅片，切割翅片以在其上形成可折叠件，将可折叠件折叠在翅片上并形成容纳孔，并将折叠件和翅片冲压成 形成两个重叠的通孔。 翅片，散热体和热管组装在一起以获得散热器。 由于翅片和散热体同时散发发热元件的热​​量，因此可以提高散热器的散热效率。

公开(公告)号：US20130094201A1

公开(公告)日：2013-04-18

申请号：US13707445

申请日：2012-12-06

Applicant: CPUMATE INC. ,  Golden Sun News Techniques Co., Ltd.

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Hwai-Ming WANG ,  Ken HSU ,  Chih-Hung CHENG

IPC: F21V29/00 ,  F21S4/00 ,  F21V5/04

CPC classification number: F21S4/003 ,  B82Y30/00 ,  B82Y99/00 ,  F21K9/27 ,  F21S8/031 ,  F21V3/02 ,  F21V5/04 ,  F21V29/506 ,  F21V29/83 ,  F21V29/85 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K3/285 ,  H05K3/3447 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/10106 ,  H05K2201/10977

Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.

Abstract translation: LED电路板的散热结构包括具有多个焊接点的LED电路板。 LED电路板的焊接点由包括纳米颗粒和粘合剂的涂层覆盖。 涂层具有发光率高，耐温性和导电性绝缘性高的特点。 另一方面，涂层可以增加焊接点与空气的接触面积，以扩大LED电路板的散热面积。 被涂层覆盖的LED电路板放置在LED灯管中，以提供良好的散热效果。

公开(公告)号：US20130126129A1

公开(公告)日：2013-05-23

申请号：US13745749

申请日：2013-01-19

Applicant: CPUMATE INC. ,  GOLDEN SUN NEWS TECHNIQUES CO., LTD.

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Ken HSU ,  Chih-Hung CHENG

IPC: F28D15/02

CPC classification number: F28D15/02 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49368 ,  Y10T29/49377 ,  Y10T29/49378 ,  Y10T29/4938 ,  H01L2924/00

Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Abstract translation: 本发明涉及一种大面积散热器，其中散热体还在其有限的空间内设置。 制造翅片的方法包括以下步骤：提供翅片，切割翅片以在其上形成可折叠件，将可折叠件折叠在翅片上并形成容纳孔，并将折叠件和翅片冲压成 形成两个重叠的通孔。 翅片，散热体和热管组装在一起以获得散热器。 由于翅片和散热体同时散发发热元件的热​​量，因此可以提高散热器的散热效率。

公开(公告)号：US20130098584A1

公开(公告)日：2013-04-25

申请号：US13716149

申请日：2012-12-16

Applicant: CPUMATE INC. ,  GOLDEN SUN NEWS TECHNIQUES CO., LTD.

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Ken HSU ,  Chih-Hung CHENG

IPC: F28D15/04

CPC classification number: F28D15/043 ,  B21D22/025 ,  B21D22/06 ,  B21D53/08 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49391 ,  Y10T29/53122

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.

Abstract translation: 公开了一种导热结构，具有导热结构的散热器和导热结构的制造方法。 该制造方法包括以下步骤：使用第一模具（20）逐渐压缩热管（10），从而提供具有不同的凹形弯曲部（211,211a，221,221a）的第一模具（20）和第二模具（30） ），并且在蒸发部分（11）处形成弯度（112），使用所述第二模具（30）压缩所述外倾角（112）以形成垂直于每个的所述接触平面（112'）和附接平面（113'） 另一方面，在接触平面（112'）上涂覆粘合剂（50），连接接触平面以使附着平面共面。