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公开(公告)号：US11260646B2
公开(公告)日：2022-03-01
申请号：US16349845
申请日：2017-11-13
Applicant: CORNING INCORPORATED
Inventor： Christina Sue Bennett , Raymond Charles Cady , Hyun-Soo Choi , Claire Renata Coble , Byungchul Kim , Timothy Michael Miller , Joseph William Soper , Gary Carl Weber
Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
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Patent Agency Ranking
公开(公告)号：US09004983B2
公开(公告)日：2015-04-14
申请号：US13955683
申请日：2013-07-31
Applicant: Corning Incorporated
Inventor： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
CPC classification number: B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
Abstract translation: 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。
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公开(公告)号：US11691364B2
公开(公告)日：2023-07-04
申请号：US17056561
申请日：2019-05-22
Applicant: CORNING INCORPORATED
Inventor： Alejandro Aguilar , Tetyana Buchholz , Raymond Charles Cady , Daniel Warren Hawtof , Shawn Michael O'Malley , Jason Daniel Steadman
CPC classification number: B29D11/00009 , G02B26/005 , B29K2995/0093
Abstract: A method of forming a liquid lens, comprising the steps of: positioning a first substrate defining a hole over a second substrate, wherein a cavity is defined within the second substrate and aligned with the hole; dispensing a second liquid into the cavity defined within the second substrate; capping the second liquid with a first liquid dispensed through the hole, wherein the first liquid and the second liquid have different refractive indices than each other; and translating at least one of the first substrate and the second substrate such that the hole is not aligned with the cavity.
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公开(公告)号：US20190275782A1
公开(公告)日：2019-09-12
申请号：US16349845
申请日：2017-11-13
Applicant: CORNING INCORPORATED
Inventor： Christina Sue Bennett , Raymond Charles Cady , Hyun-Soo Choi , Claire Renata Coble , Byungchul Kim , Timothy Michael Miller , Joseph William Soper , Gary Carl Weber
Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
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公开(公告)号：US20210206128A1
公开(公告)日：2021-07-08
申请号：US17056561
申请日：2019-05-22
Applicant: CORNING INCORPORATED
Inventor： Alejandro Aguilar , Tetyana Buchholz , Raymond Charles Cady , Daniel Warren Hawtof , Shawn Michael O'Malley , Jason Daniel Steadman
Abstract: A method of forming a liquid lens, comprising the steps of: positioning a first substrate defining a hole over a second substrate, wherein a cavity is defined within the second substrate and aligned with the hole; dispensing a second liquid into the cavity defined within the second substrate; capping the second liquid with a first liquid dispensed through the hole, wherein the first liquid and the second liquid have different refractive indices than each other; and translating at least one of the first substrate and the second substrate such that the hole is not aligned with the cavity.
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公开(公告)号：US20130316631A1
公开(公告)日：2013-11-28
申请号：US13955683
申请日：2013-07-31
Applicant: CORNING INCORPORATED
Inventor： Raymond Charles Cady , Michael John Moore , Mark Alex Shalkey , Mark Andrew Stocker
IPC: B24B37/26
CPC classification number: B24B37/26 , B24B13/02 , B24B37/20 , B24D18/0009 , Y10T29/53796 , Y10T156/1028 , Y10T156/1031
Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
Abstract translation: 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。
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