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公开(公告)号：US10994378B2
公开(公告)日：2021-05-04
申请号：US15522645
申请日：2015-10-27
Applicant: Corning Incorporated
Inventor： Timothy Michael Miller
Abstract: A die body apparatus (101) includes a first discharge member (105) configured to be bonded with respect to a base member (103) such that aligned elongated openings (209) of the base member (103) and first discharge member (105) provide a plurality of elongated feed passages placing a plurality of feed holes (106) of the base member (103) in fluid communication with a first honeycomb network of discharge slots (415) of the first discharge member (105). In further examples, methods of assembling a die body apparatus (101) includes the step of bonding a selected discharge member (105) of at least one discharge member with respect to a base member (103). In further examples methods of extruding batch material into a honeycomb body includes the steps of bonding a selected discharge member (105) with respect to a base member (103) and extruding a quantity of batch material through the die body apparatus (101) into an extruded honeycomb body with a honeycomb network of channels.
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公开(公告)号：US20170334027A1
公开(公告)日：2017-11-23
申请号：US15522645
申请日：2015-10-27
Applicant: Corning Incorporated
Inventor： Timothy Michael Miller
CPC classification number: B23P15/243 , B28B3/2663 , B28B3/269
Abstract: A die body apparatus (101) includes a first discharge member (105) configured to be bonded with respect to a base member (103) such that aligned elongated openings (209) of the base member (103) and first discharge member (105) provide a plurality of elongated feed passages placing a plurality of feed holes (106) of the base member (103) in fluid communication with a first honeycomb network of discharge slots (415) of the first discharge member (105). In further examples, methods of assembling a die body apparatus (101) includes the step of bonding a selected discharge member (105) of at least one discharge member with respect to a base member (103). In further examples methods of extruding batch material into a honeycomb body includes the steps of bonding a selected discharge member (105) with respect to a base member (103) and extruding a quantity of batch material through the die body apparatus (101) into an extruded honeycomb body with a honeycomb network of channels.
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公开(公告)号：US11260646B2
公开(公告)日：2022-03-01
申请号：US16349845
申请日：2017-11-13
Applicant: CORNING INCORPORATED
Inventor： Christina Sue Bennett , Raymond Charles Cady , Hyun-Soo Choi , Claire Renata Coble , Byungchul Kim , Timothy Michael Miller , Joseph William Soper , Gary Carl Weber
Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
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公开(公告)号：US20190275782A1
公开(公告)日：2019-09-12
申请号：US16349845
申请日：2017-11-13
Applicant: CORNING INCORPORATED
Inventor： Christina Sue Bennett , Raymond Charles Cady , Hyun-Soo Choi , Claire Renata Coble , Byungchul Kim , Timothy Michael Miller , Joseph William Soper , Gary Carl Weber
Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
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