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    DEVICE FOR DISPLAYING A BACKLIT IMAGE
    4.
    发明申请
    DEVICE FOR DISPLAYING A BACKLIT IMAGE 审中-公开

    公开(公告)号：US20170221393A1

    公开(公告)日：2017-08-03

    申请号：US15328245

    申请日：2015-07-21

    Applicant: CORNING INCORPORATED

    Inventor： Venkata Adiseshaiah Bhagavatula ,  Nagaraja Shashidhar

    IPC: G09F13/04 ,  B32B7/12 ,  B32B17/06 ,  G09F13/18

    CPC classification number: G09F13/0409 ,  B32B7/12 ,  B32B17/06 ,  B32B2307/412 ,  B32B2309/105 ,  G09F13/04 ,  G09F13/18 ,  G09F2013/049 ,  G09F2013/1804 ,  G09F2013/189

    Abstract: Disclosed herein are frameless display devices comprising a glass sheet (110) having a first surface, an opposing second surface, and a thickness between the first and second surfaces of less than 3 mm; a transparent adhesive layer (120); and an assembly comprising a backlight unit and a back panel (160); wherein at least one of the first and second surfaces is patterned with an image; and wherein the transparent adhesive layer (120) affixes the first surface of the glass sheet (110) to a surface of the assembly. Also disclosed herein are display devices comprising a glass sheet (110) having a first surface, an opposing second surface, a thickness between the first and second surfaces of less than about 3 mm, and a core having a plurality of light extraction features; a transparent adhesive layer (120); and an assembly comprising a back panel (160). Further disclosed herein are kits for making frameless display devices.

    SINGULATED SUBSTRATES FOR ELECTRONIC PACKAGING AND OTHER APPLICATIONS IN A ROLL FORMAT
    5.
    发明申请
    SINGULATED SUBSTRATES FOR ELECTRONIC PACKAGING AND OTHER APPLICATIONS IN A ROLL FORMAT 有权

    公开(公告)号：US20210125869A1

    公开(公告)日：2021-04-29

    申请号：US16965364

    申请日：2019-01-31

    Applicant: CORNING INCORPORATED

    Inventor： Nagaraja Shashidhar

    IPC: H01L21/78 ,  H01L21/02 ,  H01L21/683 ,  H01L23/14 ,  H01L23/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

    Abstract: Embodiments of the disclosure relate to a method for creating a strip of electronic components. In the method, a ribbon of ceramic substrate is provided. The ceramic substrate defines a thickness of no more than 200 μm between a first outer surface and a second outer surface opposite of the first outer surface. A conductive layer is applied to at least one of the first outer surface or the second outer surface of the ceramic substrate. The ceramic substrate is then singulated into individual slabs, and the individual slabs are laminated to a strip of polymeric carrier. The polymeric carrier has a flexural rigidity less than the flexural rigidity of the ceramic substrate. Additionally, embodiments of a roll of electronic components are provided.

    Device for displaying a backlit image
    6.
    发明授权
    Device for displaying a backlit image 有权

    公开(公告)号：US10580330B2

    公开(公告)日：2020-03-03

    申请号：US15328245

    申请日：2015-07-21

    Applicant: CORNING INCORPORATED

    Inventor： Venkata Adiseshaiah Bhagavatula ,  Nagaraja Shashidhar

    IPC: G09F13/04 ,  G09F13/18 ,  B32B7/12 ,  B32B17/06

    Abstract: Disclosed herein are frameless display devices comprising a glass sheet (110) having a first surface, an opposing second surface, and a thickness between the first and second surfaces of less than 3 mm; a transparent adhesive layer (120); and an assembly comprising a backlight unit and a back panel (160); wherein at least one of the first and second surfaces is patterned with an image; and wherein the transparent adhesive layer (120) affixes the first surface of the glass sheet (110) to a surface of the assembly. Also disclosed herein are display devices comprising a glass sheet (110) having a first surface, an opposing second surface, a thickness between the first and second surfaces of less than about 3 mm, and a core having a plurality of light extraction features; a transparent adhesive layer (120); and an assembly comprising a back panel (160). Further disclosed herein are kits for making frameless display devices.

    LOW THERMAL RESISTANCE POWER MODULE PACKAGING
    9.
    发明申请
    LOW THERMAL RESISTANCE POWER MODULE PACKAGING 审中-公开

    公开(公告)号：US20200312740A1

    公开(公告)日：2020-10-01

    申请号：US16826641

    申请日：2020-03-23

    Applicant: CORNING INCORPORATED

    Inventor： Abhijit Rao ,  Nagaraja Shashidhar

    IPC: H01L23/373 ,  H01L21/48

    Abstract: Embodiments of the disclosure relate to a method of preparing a direct plated substrate. In the method, a dielectric layer is provided that has a first major surface, a second major surface opposite to the first major surface, and a thickness between the first major surface and the second major surface. The thickness of the dielectric layer is no more than 100 μm. A first metal layer is applied to the first major surface of the dielectric layer. A second metal layer is applied to the second major surface of the dielectric layer. A base plate is joined to the second metal layer, and a metal substrate is joined to the first metal layer. A direct plated substrate made according to the method is also described herein.

    Polymer edge-covered glass articles and methods for making and using same
    10.
    发明授权
    Polymer edge-covered glass articles and methods for making and using same 有权
    聚合物边缘玻璃制品及其制造和使用方法

    公开(公告)号：US09573843B2

    公开(公告)日：2017-02-21

    申请号：US14446928

    申请日：2014-07-30

    Applicant: CORNING INCORPORATED

    Inventor： Kimberly Michelle Keegan ,  Nagaraja Shashidhar ,  Paul John Shustack ,  Kevin Andrew Vasilakos

    IPC: B32B3/10 ,  C03C17/32 ,  C03C17/34 ,  C03C17/42

    CPC classification number: C03C17/32 ,  C03C17/3405 ,  C03C17/42 ,  C03C2217/445 ,  C03C2217/47 ,  C03C2217/475 ,  C03C2217/478 ,  C03C2217/48 ,  C03C2217/77 ,  C03C2218/152 ,  Y10T428/24777

    Abstract: Described herein are various polymer-covered glass and glass-ceramic articles that exhibit improved adhesion between the polymer and the glass or glass-ceramic, along with methods for their manufacture and use. The improved articles generally include a glass or glass-ceramic substrate, a surface-roughened coating disposed on at least a portion of an edge of the glass or glass-ceramic substrate, and a polymer covering disposed on at least a portion of the surface-roughened coating. The surface-roughened coatings beneficially allow the polymer coverings to adhere better to the edge surfaces of the glass or glass-ceramic substrates relative to similar or identical articles that lack the surface-roughened coating.

    Abstract translation: 本文描述了各种聚合物覆盖的玻璃和玻璃 - 陶瓷制品，其显示出聚合物与玻璃或玻璃 - 陶瓷之间的粘合性，以及其制造和使用方法。 改进的制品通常包括玻璃或玻璃陶瓷基材，设置在玻璃或玻璃 - 陶瓷基材的边缘的至少一部分上的表面粗糙化涂层和设置在表面粗糙化层的至少一部分上的聚合物覆盖层， 粗糙涂层。 相对于缺乏表面粗糙化涂层的类似或相同的制品，表面粗糙化涂层有利地使聚合物覆盖物更好地粘附到玻璃或玻璃 - 陶瓷基材的边缘表面。

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