Abstract:
A capless electroconductive coating resistor. The resistor dielectric substrate is formed of particulate material by pressing or molding within which substrate wire leads are embedded. The green body so formed is fired to coalesce or sinter the particles and volatilize any organic constituents. Thereafter, an electroconductive coating is applied over the surface of the substrate in electrical contact with the leads.
Abstract:
A CAPLESS ELECTROCONDUCTIVE COATING RESISTOR FORMING METHOD. THE RESISTOR DIELECTRIC SUBSTRATE IS FORMED ON A CONTINOUS BASIS, PASSED BETWEEN FORMING ROLLS TO IMPART THEREIN GROOVES AND NOTCHES, COATED WITH RESISTIVE MATE RIAL, AND THEREAFTER SEPARATED INTO INDIVIDUAL RESISTO BLANKS. WIRE LEADS ARE ATTACHED DIRECTLY TO THE BLANDS BY WRAPPING THEM ABOUT THE BLANKS WITHIN THE PREFORMER GROOVES AND IN ELECTRICAL CONTACT WITH THE RESISTIVE MATERIAL COATING.
Abstract:
A CAPLESS ELECTROCONDUCTIVE COATING RESISTOR. THE RESISTOR DIELECTRIC SUBSTRATE IS FORMED OF PARTICULATE MATERIAL BY PRESSING OR MOLDING WITHIN WHICH SUBSTRATE WIRE LEADS ARE EMBEDDED. THE GREEN BODY SO FORMED IS FIRED TO COALESCE OR SINTER THE PARTICLES AND VOLATILIZED ANY ORGANIC CONSTITUTENTS. THEREAFTER, AN ELECTROCONDUCTIVE COATING IS APPLIED OVER THE SURFACE OF THE SUBSTRATE IN ELECTRICAL CONTACTWITH THE LEADS.