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公开(公告)号：US12213276B2
公开(公告)日：2025-01-28
申请号：US17900147
申请日：2022-08-31
Applicant: Cisco Technology, Inc.
Inventor： Chejung Liu , Ravinandana Mysore Ramachandra Rao , Vic Hong Chia
Abstract: A dynamic air baffle comprises: spaced-apart first and second plates configured to be positioned adjacent to at least one heat source to be cooled by an airflow; a heat insulator sandwiched between the first and second plates; and an air flap coupled to the first and second plates and extending into the airflow; wherein the first and second plates are configured such that a differential temperature between the first and second plates causes a differential expansion in lengths of the first and second plates, which rotates the air flap from a rest position, corresponding to when the differential temperature is zero, to a rotated position that is closer to a cooler plate and farther from a hotter plate of the first and second plates, such that the air flap directs more of the airflow to the hotter plate and less of the airflow to the cooler plate.
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公开(公告)号：US12075588B2
公开(公告)日：2024-08-27
申请号：US17520181
申请日：2021-11-05
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Wei Qi
IPC: H05K7/14
CPC classification number: H05K7/1411 , H05K7/1402 , H05K7/1409
Abstract: An ejector may be provided. The ejector may comprise a pawl, a trigger, and a handle. The pawl may be configured to rotate relative to a line card about a first axis. The pawl may comprise a pawl concavity. The trigger may be configured to rotate relative to the line card about a second axis. The trigger may comprise a trigger catch and a trigger lever. The trigger catch may be configured to engage the pawl concavity. The handle may be connected to the pawl and configured to rotate relative to the pawl about a third axis. The trigger catch may be configured to engage the pawl concavity to inhibit rotation of the pawl about the first axis. The trigger catch may be configured to disengage the pawl concavity and to allow rotation of the pawl about the first axis.
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公开(公告)号：US20220312636A1
公开(公告)日：2022-09-29
申请号：US17498164
申请日：2021-10-11
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.
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公开(公告)号：US20210337707A1
公开(公告)日：2021-10-28
申请号：US17369387
申请日：2021-07-07
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , George Edward Curtis , John David Stallings
Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.
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公开(公告)号：US20160128230A1
公开(公告)日：2016-05-05
申请号：US14531615
申请日：2014-11-03
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mandy Hin Lam , Hong Tran Huynh , Vic Hong Chia , M. Baris Dogruoz
CPC classification number: H05K7/20727 , H05K9/0062
Abstract: A faceplate of a line card is provided, and in one example embodiment, includes a top panel including a portion angled downward towards a front side of the faceplate, the angled portion having a plurality of holes, and a front panel disposed on the front side of the faceplate, attached to the angled portion of the top panel on its top side and having a beveled edge at its bottom side, the angled portion of the top panel and the beveled edge of the front panel facilitating an intake area for air flow between the line card and other parallel line cards assembled on a chassis. In specific embodiments, the plurality of holes are arranged in a honeycomb pattern with each hole comprising a Reuleaux hexagon having rounded corners.
Abstract translation: 提供线卡的面板，并且在一个示例性实施例中，包括顶板，其包括朝向所述面板的前侧向下倾斜的部分，所述成角度部分具有多个孔，以及设置在所述前侧上的前面板 连接到顶板的顶部的倾斜部分并且在其底侧具有倾斜边缘，顶板的倾斜部分和前面板的倾斜边缘有助于进入空气流的进入区域 线卡和其他平行线卡组装在机箱上。 在具体实施例中，多个孔布置成蜂窝图案，每个孔包括具有圆角的Reuleaux六边形。
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Patent Agency Ranking
公开(公告)号：US20240102491A1
公开(公告)日：2024-03-28
申请号：US18353596
申请日：2023-07-17
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Peter Christopher McLean , Vic Hong Chia , Zahid Naveed Aziz , Harvey Yang
CPC classification number: F04D29/644 , F04D29/522 , H05K7/20718
Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.
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公开(公告)号：US11778725B2
公开(公告)日：2023-10-03
申请号：US17524364
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K1/021 , H05K7/20336
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US11140800B2
公开(公告)日：2021-10-05
申请号：US16255229
申请日：2019-01-23
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , George Edward Curtis , Adriana del Pilar Rangel , Keith Frank Tharp , Alpesh Umakant Bhobe
Abstract: An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.
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公开(公告)号：US20210298211A1
公开(公告)日：2021-09-23
申请号：US16826557
申请日：2020-03-23
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , George Edward Curtis , John David Stallings
Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.
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10.发明申请公开(公告)号：US20200288607A1
公开(公告)日：2020-09-10
申请号：US16291715
申请日：2019-03-04
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Perry L. Hayden, SR. , Paul Matthew Plummer
Abstract: Formation of a deformation along a surface of a sheet metal panel of an electronic device is minimized or prevented by determining an area of the surface to which a deformation has developed or is predicted to develop, where the deformation forms or is predicted to form in response to one or more of the surface features being provided into the surface. A score line is provided along the surface that is at or proximate the area.
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