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公开(公告)号：US11778725B2
公开(公告)日：2023-10-03
申请号：US17524364
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K1/021 , H05K7/20336
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US12238856B2
公开(公告)日：2025-02-25
申请号：US17503000
申请日：2021-10-15
Applicant: Cisco Technology, Inc.
Inventor： Paul Ton , Yaotsan Tsai
IPC: H05K1/02 , H01L23/473 , H05K7/20
Abstract: A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.
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公开(公告)号：US20220312636A1
公开(公告)日：2022-09-29
申请号：US17498164
申请日：2021-10-11
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.
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公开(公告)号：US12156324B2
公开(公告)日：2024-11-26
申请号：US18361636
申请日：2023-07-28
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US20230392873A1
公开(公告)日：2023-12-07
申请号：US17831921
申请日：2022-06-03
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: F28D15/0266 , F28D15/04 , F28D2015/0216
Abstract: A vapor chamber for a heatsink comprises: a housing having an exterior surface with an area to be positioned adjacent to a heat source, an interior surface to enclose contiguous chambers including an evaporator chamber adjacent to the area, a condenser chamber spaced from the evaporator chamber, and a connector chamber connecting the evaporator chamber to the condenser chamber, and interior walls that partition the contiguous chambers into channels that extend from their open near ends adjacent to the evaporator chamber into the condenser chamber, to provide fluid communication between the evaporator chamber and the condenser chamber; a wick on interior surfaces of the housing and on walls of the channels; and a working fluid in the contiguous chambers to circulate between the evaporator chamber and the condenser chamber via the channels to transfer heat away from and cool the heat source.
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Patent Agency Ranking
公开(公告)号：US20230380050A1
公开(公告)日：2023-11-23
申请号：US18361636
申请日：2023-07-28
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K7/20336 , H05K1/021
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US20230147492A1
公开(公告)日：2023-05-11
申请号：US17524364
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K1/021 , H05K7/20336
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US20220354019A1
公开(公告)日：2022-11-03
申请号：US17242722
申请日：2021-04-28
Applicant: Cisco Technology, Inc.
Inventor： Yaotsan Tsai , Yongguo Chen , Hua Yang , Vic Hong Chia
IPC: H05K7/20
Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.
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公开(公告)号：US11465248B1
公开(公告)日：2022-10-11
申请号：US17365275
申请日：2021-07-01
Applicant: Cisco Technology, Inc.
Inventor： Yaotsan Tsai , Yongguo Chen , Zefeng Zhang , Hua Yang , Vic Hong Chia
IPC: B23P15/26
Abstract: Presented herein is a system including a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid. A heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid. A first pump and a second pump are configured to induce a flow in the fluid, and a reservoir is configured to store at least a portion of the fluid. A manifold is directly fluidly coupled to each of the cold plate, the heat exchanger, an inlet and an outlet of the first pump, an inlet and an outlet of the second pump and an inlet and an outlet of the reservoir.
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公开(公告)号：US12207435B2
公开(公告)日：2025-01-21
申请号：US17826520
申请日：2022-05-27
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
IPC: H05K7/20
Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, and wherein the air guider is configured to reduce air turbulence of the air when the air is propelled from the housing inlet to the housing outlet.
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