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    Thermal Interface Material (TIM) filling structure for high warpage chips
    1.
    发明授权
    Thermal Interface Material (TIM) filling structure for high warpage chips 有权

    公开(公告)号：US12156324B2

    公开(公告)日：2024-11-26

    申请号：US18361636

    申请日：2023-07-28

    Applicant: Cisco Technology, Inc.

    Inventor： Yongguo Chen ,  Yaotsan Tsai ,  Vic Hong Chia ,  Hua Yang

    IPC: H05K1/02 ,  H05K7/20

    Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.

    REMOTE DIRECTIONAL VAPOR CHAMBER HEAT SINK
    2.
    发明公开
    REMOTE DIRECTIONAL VAPOR CHAMBER HEAT SINK 审中-公开

    公开(公告)号：US20230392873A1

    公开(公告)日：2023-12-07

    申请号：US17831921

    申请日：2022-06-03

    Applicant: Cisco Technology, Inc.

    Inventor： Yongguo Chen ,  Yaotsan Tsai ,  Vic Hong Chia ,  Hua Yang

    IPC: F28D15/02 ,  F28D15/04

    CPC classification number: F28D15/0266 ,  F28D15/04 ,  F28D2015/0216

    Abstract: A vapor chamber for a heatsink comprises: a housing having an exterior surface with an area to be positioned adjacent to a heat source, an interior surface to enclose contiguous chambers including an evaporator chamber adjacent to the area, a condenser chamber spaced from the evaporator chamber, and a connector chamber connecting the evaporator chamber to the condenser chamber, and interior walls that partition the contiguous chambers into channels that extend from their open near ends adjacent to the evaporator chamber into the condenser chamber, to provide fluid communication between the evaporator chamber and the condenser chamber; a wick on interior surfaces of the housing and on walls of the channels; and a working fluid in the contiguous chambers to circulate between the evaporator chamber and the condenser chamber via the channels to transfer heat away from and cool the heat source.

    VAPOR CHAMBER EMBEDDED REMOTE HEATSINK
    7.
    发明申请
    VAPOR CHAMBER EMBEDDED REMOTE HEATSINK 有权

    公开(公告)号：US20220354019A1

    公开(公告)日：2022-11-03

    申请号：US17242722

    申请日：2021-04-28

    Applicant: Cisco Technology, Inc.

    Inventor： Yaotsan Tsai ,  Yongguo Chen ,  Hua Yang ,  Vic Hong Chia

    IPC: H05K7/20

    Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

    System and method for removing components of a fluid cooling system during operation
    8.
    发明授权
    System and method for removing components of a fluid cooling system during operation 有权

    公开(公告)号：US11465248B1

    公开(公告)日：2022-10-11

    申请号：US17365275

    申请日：2021-07-01

    Applicant: Cisco Technology, Inc.

    Inventor： Yaotsan Tsai ,  Yongguo Chen ,  Zefeng Zhang ,  Hua Yang ,  Vic Hong Chia

    IPC: B23P15/26

    Abstract: Presented herein is a system including a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid. A heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid. A first pump and a second pump are configured to induce a flow in the fluid, and a reservoir is configured to store at least a portion of the fluid. A manifold is directly fluidly coupled to each of the cold plate, the heat exchanger, an inlet and an outlet of the first pump, an inlet and an outlet of the second pump and an inlet and an outlet of the reservoir.

    Conductive Gasket
    10.
    发明申请
    Conductive Gasket 审中-公开
    导电垫片

    公开(公告)号：US20150124425A1

    公开(公告)日：2015-05-07

    申请号：US14072888

    申请日：2013-11-06

    Applicant: Cisco Technology, Inc.

    Inventor： Jing An ,  Luli Gong ,  Hua Yang ,  Hailong Zhang ,  Dewen Xu ,  Susan Huang ,  Mandy Hin Lam

    IPC: H05K9/00

    CPC classification number: H05K9/0015

    Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.

    Abstract translation: 可以提供一种装置。 该装置可以包括设置在芯的一部分上的芯和覆盖材料。 至少一个开口可以设置在芯中。 至少一个开口可以暴露在芯上的至少一个内表面。 至少一个内表面可以没有覆盖材料。

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