公开(公告)号：US11778771B2

公开(公告)日：2023-10-03

申请号：US17454571

申请日：2021-11-11

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Wei Qi ,  Yong Hong Luo ,  Hua Yang

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/2039 ,  H05K7/20736

Abstract: Embodiments for providing cooling airflow through electronic in two different directions is described. An airflow control louver system in an electronic device provides for cooling airflow to be efficiently routed through the electronic device in the two different directions which in turn allows for multiple installation configurations for electronic devices with high powered heat sensitive components.