Abstract:
In one embodiment, an apparatus includes a connector plug for attachment to a single pair Ethernet cable comprising a pair of conductors, and configured for being received in a connector receptacle. The connector plug includes a first end for receiving the single pair Ethernet cable and a second end having a pair of contacts, each of the contacts comprising a receptacle contact interface, a conductor interface, and an extension to provide an increased width between conductor gripping prongs at the conductor interface while maintaining a consistent spacing between the pair of contacts at the receptacle contact interface with connector plugs configured to mate with different gauge cables. The connector plug comprises a latch for secure attachment to the receptacle and a pull cord connected to the latch and accessible when the connector plug is inserted into the receptacle with other connector plugs for release of the connector plug.
Abstract:
An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.
Abstract:
A network connector assembly with an upper board member includes one or more upper coupling pins and a lower board member includes one or more lower coupling pins. The upper board member and lower board member each a plurality of sets of contact pins disposed on a respective top surface. A housing can be disposable over the upper board member and the lower board member forming one or more network couplers. Each of the one or more network couplers configured to receive one set of contact pins.
Abstract:
The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.
Abstract:
Method, apparatus, and electrical cable for high-speed connections. The apparatus can include an electrical cable, a wire sorter, an electrical mating paddle, and a cable assembly. The wire sorter can be coupled to an end of the electrical cable, and configured to receive wires extending from the end of the electrical cable and position the wires relative to one another in a predetermined arrangement to yield sorted wires. The electrical mating paddle card can then be coupled to the sorted wires according to the predetermined arrangement. The cable assembly can be configured to house the wire sorter and at least a portion of the wires. Moreover, the cable assembly can include a hot-melt injection chamber configured to at least partially immobilize the wires relative to the cable assembly when hot-melt is injected into the hot-melt injection chamber.
Abstract:
An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.
Abstract:
In one embodiment, an apparatus includes a connector plug for attachment to a single pair Ethernet cable comprising a pair of conductors, and configured for being received in a connector receptacle. The connector plug includes a first end for receiving the single pair Ethernet cable and a second end having a pair of contacts, each of the contacts comprising a receptacle contact interface, a conductor interface, and an extension to provide an increased width between conductor gripping prongs at the conductor interface while maintaining a consistent spacing between the pair of contacts at the receptacle contact interface with connector plugs configured to mate with different gauge cables. The connector plug comprises a latch for secure attachment to the receptacle and a pull cord connected to the latch and accessible when the connector plug is inserted into the receptacle with other connector plugs for release of the connector plug.
Abstract:
An apparatus suitable for providing ventilation and electromagnetic interference (EMI) containment for a computing device includes a first strip and a second strip. The first strip is sized to span ventilation openings of a computing device covering. The second strip intersects the first strip while also spanning the ventilation openings. Thus, the first strip and the second strip cooperate to define airflow openings within the ventilation openings, the airflow openings being sized to inhibit EMI from exiting the computing device via the ventilation openings.
Abstract:
The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.
Abstract:
An integrated connector may be provided. The integrated connector may comprise a top portion, a front portion, and a side portion. The top portion may comprise a plurality of top fingers. The front portion may comprise a plurality of receptacles and a plurality of receptacle tabs respectively corresponding to the plurality of receptacles. The side portion may comprise at least one side finger comprising a main portion, a connector portion connected to the side portion, a tail portion, a top curved portion, and a bottom curved portion. The top fingers, the plurality of receptacle tabs, and the at least one side finger may be in electrical connection.