公开(公告)号：US20150282235A1

公开(公告)日：2015-10-01

申请号：US14680825

申请日：2015-04-07

Applicant: Broadcom Corporation

Inventor： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza BEHZAD ,  Sam Ziqun ZHAO ,  Jesus Alfonso CASTANEDA ,  Michael BOERS

IPC: H04W76/02 ,  H04W4/00 ,  H04B5/00

CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract translation: 本发明的实施例涉及一种能够使无线总线进行片内和芯片间通信的无线使能分量（WEC）。 WEC包括IC（例如处理单元的处理核心）的功能块，整个IC（例如，处理单元）或包括多个IC的设备（ 例如手持设备）。 根据实施例，WEC可以与IC，单个IC或多个IC的一个或多个子块相关联。

公开(公告)号：US20130311127A1

公开(公告)日：2013-11-21

申请号：US13944430

申请日：2013-07-17

Applicant: Broadcom Corporation

Inventor： Arya Reza BEHZAD ,  Ahmadreza ROFOUGARAN ,  Sam Ziqun ZHAO ,  Jesus Alfonso CASTANEDA ,  Michael BOERS

IPC: G01R31/319

CPC classification number: G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract translation: 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。