Abstract:
The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
Abstract:
An orbiting relay assembly may be provided that has one or more switches. The switches may be provided with electrical contacts. An actuator such as an electromagnetic actuator may rotate guiding structures such as a rotating yoke about a rotational axis. The guiding structures may have portions that receive movable electrical coupling structures such as metal balls or cylinders. There may be multiple movable electrical coupling structures in a relay. The electrical coupling structures may be distributed radially outwards from the rotational axis, may be distributed circumferentially about the rotational axis, or may be distributed axially parallel to the rotational axis. The guiding structures may be configured to place the switches in one or more different operating states by moving the metal balls or other movable electrical coupling structures about the rotational axis.
Abstract:
Electronic devices may have housings. A housing may contain a display on its front face and a rear plate such as a plate formed from glass on its rear face. A peripheral housing member may surround the display and rear plate. An antenna may be formed in the peripheral housing member. The rear plate may be formed from laminated layers including a light guide layer. Device hinges may include hinge structures that are integral to the peripheral housing member. A logo may be formed by coating the rear plate with a patterned masking layer. Display structures for the display and the rear plate may be mounted to opposing sides of a shelf portion of the peripheral housing member. The rear plate may be formed from electrochromic glass and may cover photovoltaic cells and touch sensors. Driver boards may be mounted within a clutch barrel perpendicular to the display.
Abstract:
The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.
Abstract:
The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
Abstract:
A portable computer is provided that has a housing. Upper and lower portions of the housing may be joined using a hinge. A clutch mechanism may be associated with the hinge. The clutch mechanism may exhibit asymmetrical friction during opening and closing of the portable computer housing portions. Additional closing force may help to prevent the computer from having a lid that is too easy to close, without overwhelming the clutch with unnecessary friction. The clutch may have a clutch spring that is attached to a clutch shaft using a slot in the shaft. A lobe may be provided in the spring in the vicinity of the slot. A protective cap may be provided over the tip of the shaft to prevent damage to nearby wires. A friction band in the clutch may be used to directly engage an end of the spring.
Abstract:
A portable computer is provided that has a housing. A battery may be contained within the housing. The housing may have panels such as a fixed housing panel and a removable access panel. A lever actuated latching mechanism may be used to lock the removable access panel and the battery within the portable computer. A lock may be used to block movement of the lever and thereby prevent access to the interior of the computer. Magnetic elements may be used to facilitate operation of the lever and to hold the access panel in place. The latch mechanism may provide mechanical advantage when disengaging the magnets that hold the access panel.
Abstract:
A portable computer is provided that has a housing. Upper and lower portions of the housing may be joined using a hinge. A clutch mechanism may be associated with the hinge. The clutch mechanism may exhibit asymmetrical friction during opening and closing of the portable computer housing portions. Additional closing force may help to prevent the computer from having a lid that is too easy to close, without overwhelming the clutch with unnecessary friction. The clutch may have a clutch spring that is attached to a clutch shaft using a slot in the shaft. A lobe may be provided in the spring in the vicinity of the slot. A protective cap may be provided over the tip of the shaft to prevent damage to nearby wires. A friction band in the clutch may be used to directly engage an end of the spring.
Abstract:
The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.
Abstract:
The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.