公开(公告)号：US07560037B2

公开(公告)日：2009-07-14

申请号：US11213466

申请日：2005-08-26

Applicant: Bevan Staple ,  Jillian Buriak

Inventor： Bevan Staple ,  Jillian Buriak

IPC: H01B13/00

CPC classification number: B82Y30/00 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0139 ,  B81C2201/053

Abstract: A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component. The sacrificial material is removed with a release solution. At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.

Abstract translation: 通过将牺牲和结构材料沉积在衬底上以在与衬底电连接的部件上形成结构层来形成微机电结构。 结构层的电位大于元件的电位。 结构材料的至少一部分被保护材料覆盖，该保护材料具有小于或等于部件的电位的电位。 牺牲材料用释放溶液除去。 保护材料和释放溶液中的至少一种被表面活性化，表面活性剂对组分的表面进行官能化。

公开(公告)号：US20070289940A1

公开(公告)日：2007-12-20

申请号：US11213466

申请日：2005-08-26

Applicant: Bevan Staple ,  Jillian Buriak

Inventor： Bevan Staple ,  Jillian Buriak

IPC: H01B13/00

CPC classification number: B82Y30/00 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0139 ,  B81C2201/053

Abstract: A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component. The sacrificial material is removed with a release solution. At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.

Abstract translation: 通过将牺牲和结构材料沉积在衬底上以在与衬底电连接的部件上形成结构层来形成微机电结构。 结构层的电位大于元件的电位。 结构材料的至少一部分被保护材料覆盖，该保护材料具有小于或等于部件的电位的电位。 牺牲材料用释放溶液除去。 保护材料和释放溶液中的至少一种被表面活性化，表面活性剂对组分的表面进行官能化。

公开(公告)号：US07153440B2

公开(公告)日：2006-12-26

申请号：US10242213

申请日：2002-09-12

Applicant: Bevan Staple ,  Jillian Buriak

Inventor： Bevan Staple ,  Jillian Buriak

IPC: C23F1/00

CPC classification number: B82Y30/00 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0139 ,  B81C2201/053

Abstract: A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component. The sacrificial material is removed with a release solution. At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.

公开(公告)号：US20130276887A1

公开(公告)日：2013-10-24

申请号：US13906147

申请日：2013-05-30

Applicant: Brian Worfolk ,  Jillian Buriak ,  David Rider ,  Kenneth Harris

Inventor： Brian Worfolk ,  Jillian Buriak ,  David Rider ,  Kenneth Harris

IPC: H01L51/00 ,  H01L51/44

CPC classification number: H01L51/441 ,  B82Y10/00 ,  C08G61/126 ,  C08G2261/1412 ,  C08G2261/149 ,  C08G2261/3223 ,  C08G2261/72 ,  C08G2261/91 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/0047 ,  H01L51/4253 ,  Y02E10/549

Abstract: The present invention is directed to functionalized semiconducting polymers (FSPs) having the following general formula (I): wherein PB is a semiconducting polymer backbone, L is an alkyl, alkenyi or alkoxy chain and CTG is a cationic terminal group. The FSPs may be used as interfacial modifiers in organic electronics, and more specifically organic photovoltaic devices.

Abstract translation: 本发明涉及具有以下通式（I）的官能化半导体聚合物（FSP）：其中PB是半导体聚合物骨架，L是烷基，烯基或烷氧基链，CTG是阳离子末端基团。 FSP可以用作有机电子学中的界面改性剂，更具体地说是有机光伏器件。

公开(公告)号：US20050054215A1

公开(公告)日：2005-03-10

申请号：US10887792

申请日：2004-07-09

Applicant: Jillian Buriak ,  Patrick Hurley

Inventor： Jillian Buriak ,  Patrick Hurley

IPC: G01Q60/00 ,  G01Q10/04 ,  G01Q80/00 ,  H01L21/306 ,  H01L21/469

CPC classification number: H01L21/306 ,  Y10S977/857

Abstract: The present invention provides a method for preparing a silicon substrate and a silicon substrate having a silicon surface comprising a pattern of covalently bound monolayers. Each of the monolayers comprises an alkyne, wherein at least a portion of each monolayer is no more than about 5 molecules of the alkyne wide.

Abstract translation: 本发明提供一种制备硅衬底和硅衬底的方法，所述硅衬底具有包含共价结合单层图案的硅表面。 每个单层包含炔，其中每个单层的至少一部分不超过约5分子的炔。

公开(公告)号：US20110206905A1

公开(公告)日：2011-08-25

申请号：US13022584

申请日：2011-02-07

Applicant: Jillian Buriak ,  Jinan Chai ,  Kenneth Harris ,  Nathanael Wu ,  Xiaojiang Zhang

Inventor： Jillian Buriak ,  Jinan Chai ,  Kenneth Harris ,  Nathanael Wu ,  Xiaojiang Zhang

IPC: B32B3/30 ,  B05D1/36 ,  B05D5/00 ,  B05D3/00 ,  B05D3/10 ,  C25D5/54 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: C23C18/1844 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/24 ,  C08L39/04 ,  C23C18/1608 ,  C23C18/1657 ,  C23C18/1658 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/44 ,  C23C18/54 ,  Y10T428/24612

Abstract: A method for forming a block copolymer pattern on a substrate, wherein the areal density of nanostructures in the pattern is increased by increasing the thickness of the block copolymer film that is applied to the substrate.

Abstract translation: 在基材上形成嵌段共聚物图案的方法，其中通过增加施加到基材上的嵌段共聚物膜的厚度来增加图案中纳米结构的面密度。

公开(公告)号：US20050106401A1

公开(公告)日：2005-05-19

申请号：US11010100

申请日：2004-12-10

Applicant: Jillian Buriak ,  Michael Stewart ,  Edward Robins

Inventor： Jillian Buriak ,  Michael Stewart ,  Edward Robins

IPC: C07K17/14 ,  B32B9/04

CPC classification number: C07K17/14 ,  Y10S436/823 ,  Y10T428/31663

Abstract: The present invention is directed to a silicon substrate having a monolayer formed by an electrochemically-induced reaction between silicon hydride moieties on the silicon surface and optionally substituted alkynes covalently bound to the surface of the silicon substrate and to a method for electrochemically producing such a functionalized silicon substrate. The method of forming a covalently bound monolayer on a silicon surface comprises the steps of contacting the silicon surface with a C2-C24 alkyne and electrografting optionally substituted alkynes to the silicon surface.

Abstract translation: 本发明涉及具有通过硅表面上的硅氢化物部分和共价结合到硅衬底的表面上的任选取代的炔烃之间的电化学诱导反应形成的单层的硅衬底以及用于电化学生产这种官能化 硅衬底。 在硅表面上形成共价结合单层的方法包括以下步骤：使硅表面与C 2 -C 24炔烃接触，并将任选取代的炔烃电解至硅 表面。

公开(公告)号：US06288390B1

公开(公告)日：2001-09-11

申请号：US09520251

申请日：2000-03-07

Applicant: Gary E. Siuzdak ,  Jillian Buriak ,  Jing Wei

Inventor： Gary E. Siuzdak ,  Jillian Buriak ,  Jing Wei

IPC: H01J4904

CPC classification number: H01J49/0418 ,  H01J49/164

Abstract: A method for desorption and ionization of an analyte from a porous, light absorbing, semiconductor is disclosed that can be used to replace conventional mass-assisted laser desorption/ionization (MALDI) in the mass spectrometry of proteins and biomolecules. The process uses the semiconductor to trap an analyte on the semiconductor. The semiconductor is illuminated by a light source and absorbs the light energy. The semiconductor then uses the light energy is to desorbed and ionize the analyte. The analyte so desorbed and ionized is suitable for detection by mass analyzers.

Abstract translation: 公开了一种用于从多孔光吸收半导体中解析和离子化分析物的方法，可用于在蛋白质和生物分子的质谱中替代常规的质量辅助激光解吸/电离（MALDI）。 该方法使用半导体捕获半导体上的分析物。 半导体被光源照射并吸收光能。 然后，半导体使用光能将分析物解吸和电离。 被解吸和电离的分析物适用于大量分析仪的检测。

公开(公告)号：US20120301674A1

公开(公告)日：2012-11-29

申请号：US13577063

申请日：2011-02-07

Applicant: Jillian Buriak ,  Xiaojiang Zhang ,  Kenneth Harris

Inventor： Jillian Buriak ,  Xiaojiang Zhang ,  Kenneth Harris

IPC: B05D5/00 ,  H01L21/3105 ,  B05D3/06

CPC classification number: C08J3/28 ,  B82Y30/00 ,  B82Y40/00 ,  C08J2300/00 ,  C08J2353/00 ,  C09D153/00 ,  Y10T428/24355

Abstract: The present disclosure includes a method for organizing a block copolymer (BCP) comprising contacting a substrate with the block copolymer, and exposing the BCP-coated substrate to a suitable energy source under conditions sufficient to induce substrate heating and organize the block copolymer.

Abstract translation: 本公开包括用于组织嵌段共聚物（BCP）的方法，其包括使基底与嵌段共聚物接触，以及在足以诱导基底加热和组织嵌段共聚物的条件下将BCP涂覆的基底暴露于合适的能量源。

公开(公告)号：US09431612B2

公开(公告)日：2016-08-30

申请号：US14131264

申请日：2012-06-21

Applicant: Brian Worfolk ,  Qun Chen ,  Jillian Buriak

Inventor： Brian Worfolk ,  Qun Chen ,  Jillian Buriak

IPC: H01L51/40 ,  H01L51/00 ,  H01L51/44 ,  B82Y10/00 ,  H01L51/42

CPC classification number: H01L51/0021 ,  B82Y10/00 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/0047 ,  H01L51/0053 ,  H01L51/4253 ,  H01L51/441 ,  H01L51/442 ,  Y02E10/549

Abstract: The present invention is directed to methods for tailoring the work function of electrodes in organic electronics using interfacial modifiers comprising functionalized semiconducting polymers and/or small molecules.

Abstract translation: 本发明涉及使用包含官能化的半导体聚合物和/或小分子的界面改性剂来调整有机电子器件中电极的功函数的方法。