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公开(公告)号：US20140092505A1
公开(公告)日：2014-04-03
申请号：US13630114
申请日：2012-09-28
CPC分类号： G01R1/203 , G01R1/07307 , G01R19/165 , G01R31/024 , G01R31/2601 , H02H3/08 , H02H9/02 , H02H9/045
摘要： An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes.
摘要翻译： 一种装置包括探针卡，耦合到探针卡的多个分类探针和检测器电路，用于检测分类探针上的当前发生的实时时间。
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公开(公告)号：US20150077150A1
公开(公告)日：2015-03-19
申请号：US14552950
申请日：2014-11-25
CPC分类号： G01R1/203 , G01R1/07307 , G01R19/165 , G01R31/024 , G01R31/2601 , H02H3/08 , H02H9/02 , H02H9/045
摘要： An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes.
摘要翻译： 一种装置包括探针卡，耦合到探针卡的多个分类探针和检测器电路，用于检测分类探针上的当前发生的实时时间。
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公开(公告)号：US08937794B2
公开(公告)日：2015-01-20
申请号：US13630114
申请日：2012-09-28
CPC分类号： G01R1/203 , G01R1/07307 , G01R19/165 , G01R31/024 , G01R31/2601 , H02H3/08 , H02H9/02 , H02H9/045
摘要： An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes.
摘要翻译： 一种装置包括探针卡，耦合到探针卡的多个分类探针和检测器电路，用于检测分类探针上的当前发生的实时时间。
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公开(公告)号：US20230077939A1
公开(公告)日：2023-03-16
申请号：US17476120
申请日：2021-09-15
申请人： Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
发明人： Changhua Liu , Pooya Tadayon , John Heck , Srikant Nekkanty
IPC分类号： G02B6/42
摘要： An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a curved surface in a shape of a quarter cylinder that is configured to steer light emitted from the emitting lens in a direction substantially orthogonal to the first surface of the PIC.
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公开(公告)号：US20060038576A1
公开(公告)日：2006-02-23
申请号：US10922323
申请日：2004-08-19
申请人： Pooya Tadayon
发明人： Pooya Tadayon
IPC分类号： G01R31/02
CPC分类号： G01R1/06766
摘要： Briefly, in accordance with one embodiment of the invention, a sort interface unit of a wafer tester may include a micro-electromechanical system (MEMS) capacitor disposed between selected pairs of the probe tips of the sort interface unit, for example between power and ground probes. In one embodiment, the MEMS capacitor may be disposed at the ends of the probe tips nearer the wafer when the wafer is tested by the wafer tester. In another embodiment, a first capacitor having a higher value may be used for higher power circuits on the wafer, and a second capacitor having a lower value may be used for lower power circuits on the wafer. In such an arrangement, the capacitors on the probes of the sort interface unit may be selected according to a spatial power distribution of the power of the circuit or circuits on the wafer.
摘要翻译： 简而言之，根据本发明的一个实施例，晶片测试器的分类接口单元可以包括设置在分类接口单元的选定对的探针尖端之间的微机电系统（MEMS）电容器，例如在电源和地之间 探针。 在一个实施例中，当通过晶片测试器测试晶片时，MEMS电容器可以设置在靠近晶片的探针尖端的端部。 在另一个实施例中，具有较高值的第一电容器可用于晶片上的较高功率电路，并且具有较低值的第二电容器可用于晶片上的较低功率电路。 在这种布置中，可以根据晶片上的电路或电路的功率的空间功率分布来选择分类接口单元的探针上的电容器。
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公开(公告)号：US20230090133A1
公开(公告)日：2023-03-23
申请号：US17481027
申请日：2021-09-21
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.
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公开(公告)号：US20190004089A1
公开(公告)日：2019-01-03
申请号：US15640415
申请日：2017-06-30
申请人： Pooya Tadayon
发明人： Pooya Tadayon
摘要： An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.
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8.发明申请公开(公告)号：US20050029903A1
公开(公告)日：2005-02-10
申请号：US10880989
申请日：2004-06-30
申请人： Pooya Tadayon , Koorosh Zaerpoor
发明人： Pooya Tadayon , Koorosh Zaerpoor
摘要： An electrical energy-generating heat sink system provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
摘要翻译： 一种发电散热器系统为电子设备中的能量存储装置的连续再充电提供了一种便利且经济的方法。
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公开(公告)号：US06574963B1
公开(公告)日：2003-06-10
申请号：US09991110
申请日：2001-11-16
IPC分类号： F01K2508
摘要： An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
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公开(公告)号：US20230087124A1
公开(公告)日：2023-03-23
申请号：US17483013
申请日：2021-09-23
申请人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
发明人： Bai Nie , Pooya Tadayon , Leonel R. Arana , Yonggang Li , Changhua Liu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Hari Mahalingam , Benjamin Duong
IPC分类号： G02B6/42
摘要： Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.
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