公开(公告)号：US20230090133A1

公开(公告)日：2023-03-23

申请号：US17481027

申请日：2021-09-21

申请人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

发明人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

IPC分类号： G02B6/42 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00

摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

公开(公告)号：US20230087124A1

公开(公告)日：2023-03-23

申请号：US17483013

申请日：2021-09-23

申请人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

发明人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

IPC分类号： G02B6/42

摘要： Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

公开(公告)号：US20230020440A1

公开(公告)日：2023-01-19

申请号：US17955378

申请日：2022-09-28

申请人： John Heck ,  Harel Frish ,  Hari Mahalingam ,  Haisheng Rong

发明人： John Heck ,  Harel Frish ,  Hari Mahalingam ,  Haisheng Rong

IPC分类号： G02B6/30

摘要： Embodiments may include or relate to an optical coupler. The optical coupler may include a silicon nitride (SiN) waveguide. The waveguide may be formed by placing SiN on an epitaxially grown silicon structure that is then removed subsequent to placement of the SiN. Other embodiments may be described and/or claimed.