公开(公告)号：US10138557B2

公开(公告)日：2018-11-27

申请号：US15217681

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： B05D3/00 ,  C08J7/18 ,  G21H5/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  C08K3/20 ,  C23C18/36 ,  C23C18/54 ,  C08K3/22

摘要： A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

公开(公告)号：US10161045B2

公开(公告)日：2018-12-25

申请号：US15217717

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： B05D3/00 ,  C08J7/18 ,  G21H5/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  C08K3/20 ,  C23C18/36 ,  C23C18/54 ,  C08K3/22

摘要： A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

公开(公告)号：US20160333481A1

公开(公告)日：2016-11-17

申请号：US15217730

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： C23C18/18 ,  C23C18/40 ,  C23C18/16

CPC分类号： C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

摘要： A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

摘要翻译： 一种聚合物基材金属化方法及其制备的聚合物制品。 首先，提供具有分散在基础聚合物中的基础聚合物和至少一种金属化合物的聚合物基材。 然后，用能量束照射高分子基板的表面，使得聚合物基板的表面的水接触角为至少120°。 然后将聚合物基材的表面进行化学镀。

公开(公告)号：US20160326653A1

公开(公告)日：2016-11-10

申请号：US15217717

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： C23C18/18 ,  C23C18/40 ,  C23C18/16

CPC分类号： C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

摘要： A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

摘要翻译： 提供了通过该方法制备的聚合物基材和聚合物制品的金属化方法。 首先，提供具有分散在基础聚合物中的基础聚合物和至少一种金属化合物的聚合物基材。 然后，用能量束照射高分子基板的表面，使得聚合物基板的表面的水接触角为至少120°。 然后将聚合物基材的表面进行化学镀。

公开(公告)号：US10179949B2

公开(公告)日：2019-01-15

申请号：US15217730

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： B05D3/00 ,  C08J7/18 ,  G21H5/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  C08K3/20 ,  C23C18/36 ,  C23C18/54 ,  C08K3/22

摘要： A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

公开(公告)号：US20160326652A1

公开(公告)日：2016-11-10

申请号：US15217681

申请日：2016-07-22

申请人： BYD COMPANY LIMITED

发明人： Qing Gong ,  Wei Zhou ,  Yongliang Sun

IPC分类号： C23C18/18 ,  C23C18/40 ,  C23C18/16

CPC分类号： C23C18/1862 ,  C08K3/20 ,  C08K2003/2248 ,  C08K2003/2262 ,  C08K2003/2265 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1851 ,  C23C18/204 ,  C23C18/36 ,  C23C18/40 ,  C23C18/54

摘要： A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

摘要翻译： 一种聚合物基材金属化方法及其制备的聚合物制品。 首先提供具有基础聚合物和分散在基础聚合物中的至少一种金属化合物的聚合物基材。 然后用能量束照射聚合物基材的表面，使得聚合物基材的表面的水接触角至少为120°。 然后对聚合物基材的表面进行化学镀。